scholarly journals A Novel MEMS-Based Probe for Unsteady Aerodynamic Measurements: A Proof-of-Concept Study

2020 ◽  
Vol 4 ◽  
pp. 145-160
Author(s):  
William Morris ◽  
John Coull ◽  
Tony Dickens ◽  
Andrea de Luca ◽  
Florin Udrea

A novel MEMS-based probe is described which is capable of measuring unsteady flow angles, total pressure and velocity. Uniquely, this probe uses shear stress sensors to relate the surface streamline directions on the probe face to the freestream flow angles. The probe has the potential to be miniaturised to around 1mm in diameter and achieve a temporal resolution of up to several 100kHz. A computational study of virtual calibrations is used to understand how to adjust the probe geometry and sensor locations to maximise the sensitivity and range of the device. The most promising configuration was calibrated experimentally using a large-scale probe to demonstrate the feasibility of the concept.

AIAA Journal ◽  
1999 ◽  
Vol 37 ◽  
pp. 66-72
Author(s):  
Tao Pan ◽  
Daniel Hyman ◽  
Mehran Mehregany ◽  
Eli Reshotko ◽  
Steven Garverick

AIAA Journal ◽  
2002 ◽  
Vol 40 (8) ◽  
pp. 1582-1588 ◽  
Author(s):  
Mehul P. Patel ◽  
Eli Reshotko ◽  
Daniel Hyman

Author(s):  
Risa Robinson ◽  
Lynn Fuller ◽  
Harvey Palmer ◽  
Mary Frame

Blood flow regulation in the microvascular network has been investigated by means of computational fluid dynamics, in vivo particle tracking and microchannel models. It is evident from these studies that shear stress along the wall is a key factor in the communication network that results in blood flow modification, yet current methods for shear stress determination are acknowledged to be imprecise. Micromachining technology allows for the development of implantable shear stress sensors that will enable us to monitor wall shear stress at multiple locations in arteriole bifurcations. In this study, a microchannel was employed as an in vitro model of a microvessel. Thermal shear stress sensors were used to mimic the endothelial cells that line the vessel wall. A three dimensional computational model was created to simulate the system’s thermal response to the constant temperature control circuit and related wall shear stress. The model geometry included a silicon wafer section with all the fabrication layers — silicon dioxide, poly silicon resistor, silicon nitride — and a microchannel with cross section 17 μm × 17 μm. This computational technique was used to optimize the dimensions of the system for a 0.01 Reynolds number flow at room temperature in order to reduce the amount of heat lost to the substrate and to predict and maximize the signal response. Results of the design optimization are presented and the fabrication process discussed.


Author(s):  
Tao Pan ◽  
D. Hyman ◽  
M. Mehregany ◽  
E. Reshotko ◽  
B. Willis

2007 ◽  
Vol 134 (1) ◽  
pp. 77-87 ◽  
Author(s):  
A. Alvin Barlian ◽  
Sung-Jin Park ◽  
Vikram Mukundan ◽  
Beth L. Pruitt

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