scholarly journals Scratching Cu|Au Nanolaminates

Lubricants ◽  
2019 ◽  
Vol 7 (5) ◽  
pp. 44 ◽  
Author(s):  
Adrien Gola ◽  
Lars Pastewka
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulations ◽  
Layer Thickness ◽  
Wear Track ◽  
Complex Deformation ◽  
Normal Forces ◽  
Deformation Processes ◽  
Dynamics Simulations

We used molecular dynamics simulations to study the scratching of Cu|Au nanolaminates of 5 nm layer thickness with a nanoscale indenter of 15 nm radius at normal forces between 0.5 μ N and 2 μ N. Our simulations show that Au layers wear quickly while Cu layers are more resistant to wear. Plowing was accompanied by the roughening of the Cu|Au heterointerface that lead to the folding of the nanolaminate structure at the edge of the wear track. Our explorative simulations hint at the complex deformation processes occurring in nanolaminates under tribological load.

scholarly journals Deformation processes in polycrystalline Zr by molecular dynamics simulations

2015 ◽  
Vol 462 ◽  
pp. 147-159 ◽  
Author(s):  
Zizhe Lu ◽  
Mark J. Noordhoek ◽  
Aleksandr Chernatynskiy ◽  
Susan B. Sinnott ◽  
Simon R. Phillpot
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulations ◽  
Deformation Processes ◽  
Dynamics Simulations

Study of Processability of Cu/Ni Bilayers Using Molecular Dynamics Simulations

2018 ◽  
Vol 52 ◽  
pp. 43-53
Author(s):  
Yan Zhang ◽  
Wan Shen Xiao ◽  
Ping Peng
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulations ◽  
Single Crystals ◽  
Strengthening Mechanism ◽  
Machining Processes ◽  
Friction Forces ◽  
Normal Forces ◽  
Dynamics Simulations ◽  
Metal Bilayers ◽  
Processing Properties

Nanoscratching and nanoindentation simulations are performed to study the processability of Cu/Ni bilayers with interfaces using molecular dynamics (MD) method. Single crystals Cu and Ni are served as comparisons. In the nanoscratching processes, the interfaces of Cu/Ni bilayers appear as a barrier of dislocations gliding, and lead to larger friction forces and normal forces. For single crystals and bilayers, both their friction forces and normal forces increase with the increasement of scratch velocity at 100-300 m/s. Friction coefficients under scratching processes are calculated, and they are smaller than macrosacle scratching process because of coating effects of nano-chips on the tool. The effects are analyzed by conducting both molecular dynamics simulations in nanoscale and finite element simulations (FES) in macroscale. In the indentation process, the processing properties of Cu-Ni and Ni-Cu bilayers are different from each other, and their indentation forces are both larger than their single crystals. Recovery deformation takes place during the relaxation stage. When the tool is unloading, some workpiece atoms adhere to the tool. The simulation results of the two nanoscale machining processes reveal the strengthening mechanism of interface, and show comprehensive processability of metal bilayers.

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