scholarly journals Dynamic Deformation Measurement of Specular Surface with Deflectometry and Speckle Digital Image Correlation

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1278 ◽  
Author(s):  
Yao Hu ◽  
Shaopu Wang ◽  
Xuemin Cheng ◽  
Chengqiang Xu ◽  
Qun Hao

The deformation measurement of a specular surface is of great importance during the quality inspection and installation of optical elements or wafers, especially those with large apertures. We propose a deflectometry method with speckle digital image correlation (DeSDIC) to realize the dynamic and high-accuracy measurement of the deformation on specular surfaces, with a simple system structure and robustness to noises and environmental vibrations. Random speckle pattern displayed on liquid crystal display is reflected by the original surface under test (SUT), and the distorted pattern is recorded by a camera. This originally distorted pattern is taken as the reference image, and the patterns captured afterwards are digitally correlated with the reference image to calculate the gradient change and deformation of the SUT. The theoretical relationships and an experimental one-step calibration scheme are proposed. Both static and dynamic deformations of a deformable mirror were experimentally measured to demonstrate the feasibility and accuracy of DeSDIC, which is comparable to phase-measuring deflectometry and interferometry.

2013 ◽  
Vol 677 ◽  
pp. 406-411 ◽  
Author(s):  
Xing Hua Chai ◽  
Xiao Ping Lou ◽  
Nai Guang Lv

This paper refers to two whole-field , non-contact experimental techniques:Digital Speckle Pattern Interferometry (DSPI) and Digital Image Correlation (DIC). The former can measure 3-D deformations in nanometric level. The latter can measure small displacement in micrometric level. DSPI needs a phase-shifting setup and rotating the whole device for 3-D deformation measurement. Two CCD cameras will be required recording speckle image simultaneously for 3-D measurement by DIC method. An optical system which is a combination of the two measurement method is proposed in this paper. Digital image correlation setup using one CCD camera for in-plane measurement and digital speckle pattern interferometric setup for out-plane measurement constitutes this measurement system. Three dimensions information of deformation can be recorded simultaneously by one 3-color CCD camera. This system can be used to measure deformation with a small out-plane component and a relatively larger in-plane component.


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