Ultrasonic bonding of fine-pitch Au stud flip chip bump with flexible printed circuit board

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Jeong-Won Yoon ◽  
...  
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Jong-Gun Lee ◽  
Jung-Lae Jo ◽  
Ja-Myeong Koo ◽  
Chang-Keun Chun ◽  
...  

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2015 ◽  
Vol 11 (6) ◽  
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Chorng-Tyan Lin ◽  
Cheng-Chung Chang ◽  
Jyh-Horng Chou

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Jaehyeong Jeong ◽  
Anton Nailevich Gafurov ◽  
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