Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments

This study employed finite element analysis to simulate ultrasonic metal bump direct bonding. The stress distribution on bonding interfaces in metal bump arrays made of Al, Cu, and Ni/Pd/Au was simulated by adjusting geometrical parameters of the bumps, including the shape, size, and height; the bonding was performed with ultrasonic vibration with a frequency of 35 kHz under a force of 200 N, temperature of 200 °C, and duration of 5 s. The simulation results revealed that the maximum stress of square bumps was greater than that of round bumps. The maximum stress of little square bumps was at least 15% greater than those of little round bumps and big round bumps. An experimental demonstration was performed in which bumps were created on Si chips through Al sputtering and lithography processes. Subtractive lithography etching was the only effective process for the bonding of bumps, and Ar plasma treatment magnified the joint strength. The actual joint shear strength was positively proportional to the simulated maximum stress. Specifically, the shear strength reached 44.6 MPa in the case of ultrasonic bonding for the little Al square bumps.

Study on the ultrasonic guided wave and online visual monitoring for ultrasonic precise bonding

Ultrasonic precise bonding is an emerging technology in the application of polymer micro-assembly. In the ultrasonic bonding process, the propagation of ultrasound varies with the change of the interfacial polymer physical state. So the ultrasonic guided wave is an effective parameter to in-situ monitor the fusion degree. The ultrasonic guided wave in the ultrasonic bonding process is studied by vibration analysis and online visual monitoring in this paper. The time-frequency characteristics in the ultrasonic guided wave in the bonding process are mainly analyzed by Fast Fourier Transform spectrum analysis, Wavelet Packet Decomposition, and envelope spectrum methods. The polymer interfacial fusion is monitored by the high-speed HD camera in the ultrasonic bonding process. The time-frequency characteristics in the ultrasonic guided wave and the fusion behavior of the thermal melt interface are analyzed and correlated. Results indicate that the change of the interfacial thermal melt state is related to the time-frequency characteristics of the ultrasonic guided wave. The fusion of the melting zone, the rotation of the micro-device, the generation or disappearance of local air bubbles all lead to the changing of the harmonic frequency and intensity in the ultrasonic bonding process.

Ultrasonic Deposition of Carbon Nanotubes on Polycrystalline Cubic Boron Nitride Composites

Polycrystalline cubic boron nitride (PcBN) are super-hard materials with high hardness and excellent abrasive resistance, widely used in cutting tools for precision machining of automotive and aerospace parts; however, their brittle properties make them prone to premature failure. Coatings are often applied to PcBN to extend their range of applicability and durability. Conventional coating methods are limited to the thickness range of a few hundred nanometres, poor adhesion to the substrate, and limited stability under ambient conditions. To further the properties of PcBN composites, in this paper, we explore the use of ultrasonic bonding to apply thick coatings (30–80 μm) on PcBN cutting tools. For the first time, a multi-walled carbon nanotube (MWCNT) powder is preplaced on a PcBN substrate to allow an unconventional coating technique to take place. The effects of ultrasonic bonding parameters on the change of mechanical properties of the coated tools are investigated through scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), micro-hardness analyses, and white light interferometry. The structure of the carbon nanotubes is investigated through transmission electron microscopy (pre coating) and cross-section of the bonded MWCNTs is studied via focused ion beam milling and SEM to evaluate the bonding between the multi-walled nanotubes. Optimum processing windows (i.e., bonding speed, energy, and pressure) are discovered for coating MWCNTs on PcBN. Focus ion beam milling analyses revealed a relationship between consolidation parameters and porosity of MW(pCNT) bonds. The proposed method paves the way for the novel design of functional coatings with attunable properties (i.e., thickness and hardness) and therefore improved productivity in the machining of aerospace and automotive parts.

Graphene-Based Contacts for Optoelectronic Devices

Hybrid transparent contacts based on combinations of a transparent conductive oxide and a few graphene monolayers were developed in order to evaluate their optical and electrical performance with the main aim to use them as front contacts in optoelectronic devices. The assessment of the most suitable strategies for their fabrication was performed by testing different protocols addressing such issues as the protection of the device structure underneath, the limitation of sample temperature during the graphene-monolayer transfer process and the determination of the most suitable stacking structure. Suitable metal ohmic electrodes were also evaluated. Among a number of options tested, the metal contact based on Ti + Ag showed the highest reproducibility and the lowest contact resistivity. Finally, with the objective of extracting the current generated from optoelectronic devices to the output pins of an external package, focusing on a near future commercial application, the electrical properties of the connections made with an ultrasonic bonding machine (sonic welding) between the optimized Ti + Ag metal contacts and Al or Au micro-wires were also evaluated. All these results have an enormous potential as hybrid electrodes based on graphene to be used in novel designs of a future generation of optoelectronic devices, such as solar cells.

An Oxide Wear Model of Ultrasonic Bonding

A modeling approach is developed to better describe the relation between input electrical power and the physical reaction of the bonding system during ultrasonic bonding. The major distinction between this analysis and previously published works is to attempt to eliminate empirically driven correlations between the input power and the kinetics of the bonding process. Two models, a piezoelectric model and an ultrasonic bonding model, are combined in order to reach this goal. The piezoelectric model is used to calculate the desired forcing, amplitude, and frequency that is created by the piezoelectric transducer during the actual ultrasonic bonding process. For this process, a lumped parameter model, taken from literature, is used, that converts input current and voltage to velocity and position of the bonding tooltip, respectively. This model is then combined with an updated model of the relative amplitude between the bonding material and substrate as the ultrasonic bond is being formed. Our model differs from existing friction power models by utilizing the Archard Equation to account for the removal of the natural oxide film. The integrated model provides a relationship between the bond growth and the driving power. The analysis enables comparison between the transverse force on the bond tool and amplitude of the bond tool’s motion for different electrical input powers.

Wire Bonding: The Ultrasonic Bonding Mechanism

Wire bonding is a welding process. During both ball and wedge bonding, wire and bond pad are massively deformed between the bond tool and the anvil of the bond pad or substrate. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing is not at equilibrium in that it does not initially form the compounds described by the equilibrium phase diagram, but temperature and time very quickly allows diffusion to relax the initial mixture into the equilibrium phase diagram compounds. This paper will discuss the mechanisms behind the formation of ball and wedge bonds.