Nano-level High Sensitivity Measurement Using Microscopic Moiré Interferometry

2008 ◽  
Vol 32 (2) ◽  
pp. 186-193 ◽  
Author(s):  
Jin-Won Joo ◽  
Han-Jun Kim
Keyword(s):  
High Sensitivity ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Sensitivity Measurement

Residual Stress Measurement in Spot Welds and the Effect of Fatigue Loading on Redistribution of Stresses Using High Sensitivity Moire´ Interferometry

2000 ◽  
Vol 123 (1) ◽  
pp. 132-138 ◽  
Author(s):  
Sanjeev K. Khanna ◽  
Canlong He ◽  
Hari N. Agrawal
Keyword(s):  
Residual Stress ◽  
Stress Measurement ◽  
Low Cycle Fatigue ◽  
High Sensitivity ◽  
Fatigue Loading ◽  
Moiré Interferometry ◽  
Spot Weld ◽  
Moire Interferometry ◽  
Spot Welds ◽  
Full Field

Residual stress distribution has been determined in spot welds, which are generally used to join mild steel sheets. Various spot weld configurations were investigated using the full-field, experimental, optical technique of high sensitivity moire´ interferometry. These stresses were found to be in the range 250–300 MPa (tensile) in the center and decreased to 40–100 MPa (tensile) at the edge of the weld nugget. Low cycle fatigue loading of the spot weld caused the residual stress to drop in the weld center by about 30 percent and increase at the edges by as much as 100 percent.

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

2005 ◽  
Vol 127 (2) ◽  
pp. 86-90 ◽  
Author(s):  
Woon-Seong Kwon ◽  
Myung-Jin Yim ◽  
Kyung-Wook Paik ◽  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Thermal Cycling ◽  
Thermal Deformation ◽  
Flip Chip ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Acoustic Microscopy ◽  
Moire Interferometry ◽  
Organic Substrates ◽  
Conductive Adhesives ◽  
Reliability Performance

One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy investigation was performed for tested assemblies. To elucidate the effects of ACF material properties and DNP on the thermal cycling reliability of ACF assembly, Weibull analysis for the lifetime estimation of ACF joint was performed, and compared with thermal deformations of ACF flip chip assembly investigated by moire´ interferometry. Results indicate that the properties of ACF have a significant role in the thermal deformation and reliability performance during thermal cycling testing. Therefore, optimized ACF properties can enhance ACF package reliability during thermal cycling regime.

HIGH-TEMPERATURE, HIGH-SENSITIVITY MOIRÉ INTERFEROMETRY

1993 ◽  
Vol 17 (3) ◽  
pp. 29-33 ◽  
Author(s):  
R. Czarnek ◽  
J.J. Wu ◽  
S.Y. Lin ◽  
J. Lee
Keyword(s):  
High Temperature ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Moire Interferometry

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

1995 ◽  
Vol 117 (3) ◽  
pp. 185-191 ◽  
Author(s):  
B. Han ◽  
Y. Guo
Keyword(s):  
Mechanical Behavior ◽  
Electronic Packaging ◽  
Early Stage ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry ◽  
Plated Through Hole ◽  
Chip Carrier

Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

Sign in / Sign up

Export Citation Format

Share Document