Finite Element Analysis of Stress and Strain Distribution in Gold Thin Film Deposited on Polycarbonate Substrate Subjected to Tension and Cooling
2015 ◽
Vol 752-753
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pp. 55-61
Keyword(s):
Thin metal films on polymeric materials have been widely used in electronic devices. Their total mechanical performance is determined by the mechanical property of each material, the thickness and size of film and substrate, their interface properties in addition to the temperature change during production and use. In this paper, stress and strain distribution of gold thin film on polycarbonate substrate subjected to tension and cooling was analyzed using the finite element method. The effect of cracking in thin film on the stress and strain distribution was also discussed.
2012 ◽
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2012 ◽
Vol 46
(4)
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pp. 175-182
◽
2019 ◽
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2013 ◽
Vol 325-326
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pp. 718-721