Analyzing and Counter Plan Researches on Technical Index of Wire Electric Discharge Machining Based on the Surface Quality Issues

2010 ◽  
Vol 148-149 ◽  
pp. 943-948
Author(s):  
Jin Chun Feng ◽  
Xian Wen Wu ◽  
Deng Wan Li

In this paper, the writers analyze some issues that influence parts surface quality on HS- WEDM and its related counter plan, which are Summed up from practice and producing experiences. It has certain guiding significant to improve surface quality of part in practice production.

2016 ◽  
Vol 876 ◽  
pp. 36-42 ◽  
Author(s):  
Sergey Nikolaevich Grigoriev ◽  
Mikhail Pavlovich Kozochkin ◽  
Artur Nikolaevich Porvatov

The results of the research of vibro-acoustic signals, accompanying the processes of electrical discharge machining and pulsed laser treatment, are presented in this article. It is shown that the monitoring parameters of vibro-acoustic signals can improve the quality of management spark erosion equipment.


2021 ◽  
Vol 1026 ◽  
pp. 28-38
Author(s):  
I. Vishal Manoj ◽  
S. Narendranath ◽  
Alokesh Pramanik

Wire electric discharge machining non-contact machining process based on spark erosion technique. It can machine difficult-to-cut materials with excellent precision. In this paper Alloy-X, a nickel-based superalloy was machined at different machining parameters. Input parameters like pulse on time, pulse off time, servo voltage and wire feed were employed for the machining. Response parameters like cutting speed and surface roughness were analyzed from the L25 orthogonal experiments. It was noted that the pulse on time and servo voltage were the most influential parameters. Both cutting speed and surface roughness increased on increase in pulse on time and decrease in servo voltage. Grey relation analysis was performed to get the optimal parametric setting. Response surface method and artificial neural network predictors were used in the prediction of cutting speed and surface roughness. It was found that among the two predictors artificial neural network was accurate than response surface method.


2014 ◽  
Vol 778-780 ◽  
pp. 776-779 ◽  
Author(s):  
Masumi Ogawa ◽  
Kei Mine ◽  
Seiki Fuchiyama ◽  
Yasuhiro Tawa ◽  
Tomohisa Kato

In order to slice the larger size ingot toward 6 inch of silicon carbide (SiC), we are developing Multi-wire Electric Discharge Machining (EDM). To prevent wire break during slicing, we have developed the electric discharge pulse control system. So far, with 10 multi-wires, we have succeeded in slicing of 4 inch SiC balk single crystal without wire break. High quality slicing surface (e.g. small value of around 10 μm of SORI for 3 inchi wafer) was also achieved. By polishing methode, EDM-sliced wafer was estimated to have the uniform thickness of damaged layer over the entire surface. We confirmed that the wafer sliced by EDM can be processed in the later process, by grinding the 3 inch wafer. And it was confirmed that 6 inch ingot can be sliced with 10 multi-wire EDM, by slicing the boule of SiC poly crystal. For the larger diameter ingot than 4 inch, Multi-wire EDM will be practically used by the effective removal of machining chips from the machining clearance between the wire and work.


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