From Niihara's Equation to Peculiar Nanoindentation Deformation of Ceramics and Semiconductors

2006 ◽  
Vol 317-318 ◽  
pp. 293-296
Author(s):  
Roman Nowak ◽  
Ari T. Hirvonen ◽  
Tohru Sekino

The present paper is based on the contribution by Niihara and his co-workers devoted to indentation testing of ceramic materials, while it provides new observations of peculiarities registered during nanoindentation of sapphire, GaAs and InGaNAs deposited by MBE-technique. Exploiting previous studies of the spherical indentation in sapphire, the present authors recognized different causes that result in the apparently similar pop-in phenomenon for sapphire and GaAs-based semiconductors. The finite element modeling of the quasi-plastic nanoindentation of the ( 1 1 20) plane of sapphire with the elastically deformable tip confirmed that the deformation of sapphire is governed by twinning which causes pop-in phenomenon, as suggested earlier by Niihara et al. The singularities registered for GaAs-based crystals are associated with dislocation movement within {111} slip bands, which is in contrast to the case of sapphire.

2004 ◽  
Vol 19 (1) ◽  
pp. 218-227 ◽  
Author(s):  
J.A. Knapp ◽  
D.M. Follstaedt

Thin-film mechanical properties can be measured using nanoindentation combined with detailed finite element modeling. This technique was used for a study of very fine grained Ni films, formed using pulsed-laser deposition on fused silica, sapphire, and Ni substrates. The grain sizes in the films were characterized by electron microscopy, and the mechanical properties were determined by ultra-low load indentation, analyzed using finite element modeling to separate the mechanical properties of the thin layers from those of the substrates. Some Ni films were deposited at high temperature or annealed after deposition to enlarge the grain sizes. The observed hardnesses and grain sizes in these thin Ni films are consistent with the empirical Hall–Petch relationship for grain sizes ranging from a few micrometers to as small as 10 nm, suggesting that deformation occurs preferentially by dislocation movement even in such nanometer-size grains.


1991 ◽  
Vol 3 (1) ◽  
pp. 235-253 ◽  
Author(s):  
L. D. Philipp ◽  
Q. H. Nguyen ◽  
D. D. Derkacht ◽  
D. J. Lynch ◽  
A. Mahmood

1993 ◽  
Vol 21 (1) ◽  
pp. 23-39 ◽  
Author(s):  
R. W. Scavuzzo ◽  
T. R. Richards ◽  
L. T. Charek

Abstract Tire vibration modes are known to play a key role in vehicle ride, for applications ranging from passenger cars to earthmover equipment. Inputs to the tire such as discrete impacts (harshness), rough road surfaces, tire nonuniformities, and tread patterns can potentially excite tire vibration modes. Many parameters affect the frequency of tire vibration modes: tire size, tire construction, inflation pressure, and operating conditions such as speed, load, and temperature. This paper discusses the influence of these parameters on tire vibration modes and describes how these tire modes influence vehicle ride quality. Results from both finite element modeling and modal testing are discussed.


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