Study on the Factors of Residual Thermal Stress on Single Lap Joint

2015 ◽  
Vol 813 ◽  
pp. 28-34
Author(s):  
Cheng Kun Ma ◽  
Ji Feng Zhang ◽  
Bin Yang ◽  
Lu Zhang ◽  
Qi Chen

This paper discussed the residual thermal stress on single lap joint of various materials. Finite element method (FEM) was adopted to simulate the experimental phenomena. The adherend and adhesive were the main research objects. Mismatch of adherend, adhesive thickness, temperature variation which were the three key factors on the residual thermal stress were analyzed. While, four kinds of materials that include C/SiC, SiC, high temperature nickel based alloy GH1035 (GH1035) and high temperature boron fiber reinforced epoxy composite (composite) formed seven approaches for numerical analysis. The results showed that the adhesive with the C/SiC has the best performance and the best thickness of every approach was determined. Moreover, the ladder temperature is better than other temperature styles.

2011 ◽  
Vol 2011.49 (0) ◽  
pp. 505-506
Author(s):  
Yu ZHANG ◽  
Kentarou TAKAISHI ◽  
Nao-Aki NODA ◽  
Hiroyuki SHIBAHARA

2011 ◽  
Vol 230-232 ◽  
pp. 1345-1349 ◽  
Author(s):  
Cun Jun Chen ◽  
Min You ◽  
Hai Zhou Yu ◽  
Jian Li Li ◽  
Chun Zhi Mei

The temperature field in the adhesively bonded single lap steel joint after a thermal shock (100 °C, 10s) and the influence of the restraint on the thermal stress in the joint was investigated using elasto-plastic finite element method (FEM). The results showed that the temperature in the overlap region is symmetrically distributed to the bondline after the thermal shock. Five kinds of constraints were applied in the study and it is found that the peak value of the thermal stresses were occurred at the points near the free ends of the adherend lap zone along the mid-bondline under the action of constraining the adherends in the direction of both transversal and longitudinal. The symbol of the longitudinal stress Sx and peel stress Sy is negative.


Materials ◽  
2018 ◽  
Vol 11 (7) ◽  
pp. 1198 ◽  
Author(s):  
Chengkun Ma ◽  
Yuan Tian ◽  
Yan Gong ◽  
Jifeng Zhang ◽  
Hui Qi ◽  
...  

High-temperature phosphate adhesives are widely used in the aerospace and nuclear power industries. However, complex residual stresses can result when the curing temperature parameters are unreasonable due to the brittleness of the adhesive. To reveal the curing temperature mechanism affecting the bonding strength of the phosphate adhesives, several curing temperature curves (CT-1~6) were designed for the single lap joint (SLJ) using phosphate adhesive. The residual stress helped to reveal the relationship between the curing temperature parameters and the bonding performance. In this process, the residual stress of the silicon carbide joint was measured using micro-Raman spectroscopy, and the tensile strength of the joint was tested. A cohesive zone model (CZM) was established with Abaqus® to verify the results, and the numerical results from the model agreed well with the experimental values. The residual stress and adhesive strength were obviously affected by curing temperature. The reasonable curing temperature curves have the benefits of reducing the residual stress and improving the bonding strength.


2012 ◽  
Vol 511 ◽  
pp. 159-162
Author(s):  
Min You ◽  
Chun Zhi Mei ◽  
Cun Jun Chen ◽  
Jian Li Li ◽  
Mei Li

The effect of the thermal shock time on the thermal stress distributed in the adhesively bonded steel single lap steel joint under a 100 C thermal shock was investigated using elasto-plastic finite element method (FEM). The results showed that the temperature is symmetrically distributed to the bondline in the overlap region and the lowest one at the mid-bondline increases as the time of the thermal shock elongated (4 s to 40 s). And all the peak values of the stresses at the mid-bondline and the zone of negative Sx in adherend decreased as the time of the thermal shock elongated.


2015 ◽  
Vol 2015 (0) ◽  
pp. _S1910101--_S1910101-
Author(s):  
Atsushi TAKANO ◽  
Yusuke GOTO ◽  
Yuta YAMAMOTO

2011 ◽  
Vol 2011 (0) ◽  
pp. _OS1306-1_-_OS1306-3_
Author(s):  
Yu ZHANG ◽  
Kentaro TAKAISHI ◽  
Nao-Aki NODA ◽  
Xin LAN

2012 ◽  
Vol 166-169 ◽  
pp. 2896-2899
Author(s):  
Min You ◽  
Cun Jun Chen ◽  
Hai Zhou Yu ◽  
Chun Zhi Mei ◽  
Mei Li

The effect of the thermal shock temperature on the thermal stress distributed in the adhesively bonded steel single lap steel joint under a 10 s thermal shock was investigated using elasto-plastic finite element method (FEM). The results showed that both the highest temperature at the surface and the lowest one at the mid-bondline increases as the temperature of the thermal shock raised (80 C to 140 C) and all the peak values of the stresses at the mid-bondline and the zone of negative Sx in adherend increased as the temperature of the thermal shock elevated.


2015 ◽  
Vol 2015.53 (0) ◽  
pp. _407-1_-_407-2_
Author(s):  
Shun Yoshida ◽  
Yusuke KAKIZAWA ◽  
Tomomi AKIYAMA ◽  
Makiko YONEHARA ◽  
Yasusuke KAWABATA ◽  
...  

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