Investigation of the Impact of Micro-Structuring on the Bonding Performance of Beechwood (Fagus Sylvatica L.)

Although glueing softwood is well mastered by the industry, predicting and controlling bond quality for hardwood is still challenging after years of research. Parameters such as the adhesive type, resin–hardener ratio, and the penetration behaviour of the wood are determinants for the bond quality. The aim of this work was to assess to what extent the glueing behaviour of beechwood can be improved by using structural planing. The different surfacing methods were characterised by their roughness. The bond strength of the micro-structured surfaces was determined according to EN 302-1, and the delamination resistance was tested as indicated by EN 302-2 for type I adhesives. Micro-structured surfaces were compared with different surfaces (generated by surfacing methods such as dull/sharp planing and sanding). In dry test conditions, all surfacing methods gave satisfying results. In the wet stage, the bond strength on the finer micro-structured surface slightly outperformed the coarse structure surface. For the delamination resistance, a clear improvement could be observed for melamine-formaldehyde-bonded specimens since, when using the recommended amount of adhesive, micro-structured surfaces fulfilled the requirements. Nevertheless, structural planing cannot lead to a reduction in the applied grammage since no sample with a smaller amount fulfilled EN 302-2 requirements even by observing the recommended closed assembly waiting time. Adhesion area enlargement of the micro-structuring is minor. The good delamination performance without waiting time (CAT) is not caused by surface enlargement, since finer micro-structured surface with negligible area increase and delivered even better delamination resistance. Subsurface analysis should be carried out to thoroughly investigate this phenomenon.

Hybrid Electron Beam Powder Bed Fusion Additive Manufacturing of Ti–6Al–4V: Processing, Microstructure, and Mechanical Properties

Processing, microstructure, and mechanical properties of the hybrid electron beam powder bed fusion (E-PBF) additive manufacturing of Ti–6Al–4V have been investigated. We explore the possibility of integrating the substrate as a part of the final component as a repair, integrated, or consolidated part. Various starting plate surface conditions are used to understand the joining behavior and their microstructural properties in the bonding region between the plate and initial deposited layers. It is found that mechanical failures mainly occur within the substrate region due to the dominant plastic strains localized in the weaker Ti–6Al–4V substrate. The hybrid concept is successfully proven with satisfactory bonding performance between the E-PBF build and substrate. This investigation improves the practice of using the hybrid E-PBF additive manufacturing technique and provides basic understanding to this approach.

Βio-Based Epoxy/Amine Reinforced with Reduced Graphene Oxide (rGO) or GLYMO-rGO: Study of Curing Kinetics, Mechanical Properties, Lamination and Bonding Performance

In this work, we report the synthesis and study of nanocomposites with a biobased epoxy/amine (Epilok 60-600G/Curamine 30-952) matrix reinforced with reduced graphene oxide (rGO) or functionalised with 3-glycidoxypropyltrimethoxysilane (GLYMO-rGO). These graphene related materials (GRMs) were first dispersed into a Curamine hardener using bath ultrasonication, followed by the addition of epoxy resin. Curing kinetics were studied by DSC under non-isothermal and isothermal conditions. The addition of 1.5 wt% of GLYMO-rGO into the epoxy matrix was found to increase the degree of cure by up to 12% and glass transition temperature by 14 °C. Mechanical testing showed that the addition of 0.05 wt% GLYMO-rGO improves Young’s modulus and tensile strength by 60% and 16%, respectively, compared to neat epoxy. Carbon fibre reinforced polymer (CFRP) laminates were prepared via hand lay up, using the nanocomposite system GRM/Epilok/Curamine as matrix, and were cut as CFRP adherents for lap shear joints. GRM/Epilok/Curamine was also used as adhesive to bond CFRP/CFRP and CFRP/aluminium adherents. The addition of 0.1 wt% GLYMO-rGO into the adhesive and CRFP adherents showed improved lap shear strength by 23.6% compared to neat resin, while in the case of CFRP/Aluminium joints the increase was 21.2%.

Integrated Design of Structure and Material of Epoxy Asphalt Mixture Used in Steel Bridge Deck Pavement

To comprehensively investigate the integrated structural and material design of the epoxy asphalt mixture used in steel bridge deck pavement, the following works have been conducted: 1. The strain level of steel bridge deck pavement was calculated; 2. The ultimate strain level of fatigue endurance for epoxy asphalt concrete was measured; 3. The effect of water tightness of epoxy asphalt mixture on the bonding performance of steel plate interface was tested. 4. For better performance evaluation, quantitative analysis of the anti-skid performance of epoxy asphalt mixture was carried out by testing the structure depth using a laser texture tester. Results show the following findings: 1. The fatigue endurance limit strain level of epoxy asphalt mixture (600 με) was higher than that of the steel bridge deck pavement (<300 με), indicating that the use of epoxy asphalt concrete has better flexibility and can achieve a longer service life in theory; 2. The epoxy asphalt concrete has significant water tightness to protect the steel plate interface from corrosion and ensure good bonding performance; 3. The porosity of epoxy asphalt mixture used in steel bridge deck paving should be controlled within 3%; 4. In terms of anti-skid performance of bridge deck pavement, the FAC-10 graded epoxy asphalt mixture is recommended when compared with EA-10C.

Pressure-Free Assembling of Poly(Methyl Methacrylate) Microdevices via Microwave-Assisted Solvent Bonding and Its Biomedical Applications

Poly(methyl methacrylate) (PMMA) has become an appealing material for manufacturing microfluidic chips, particularly for biomedical applications, because of its transparency and biocompatibility, making the development of an appropriate bonding strategy critical. In our research, we used acetic acid as a solvent to create a pressure-free assembly of PMMA microdevices. The acetic acid applied between the PMMA slabs was activated by microwave using a household microwave oven to tightly merge the substrates without external pressure such as clamps. The bonding performance was tested and a superior bond strength of 14.95 ± 0.77 MPa was achieved when 70% acetic acid was used. Over a long period, the assembled PMMA device with microchannels did not show any leakage. PMMA microdevices were also built as a serpentine 2D passive micromixer and cell culture platform to demonstrate their applicability. The results demonstrated that the bonding scheme allows for the easy assembly of PMMAs with a low risk of clogging and is highly biocompatible. This method provides for a simple but robust assembly of PMMA microdevices in a short time without requiring expensive instruments.

Bonding Performance for Repairs Using Bulk Fill and Conventional Methacrylate Composites

This study compared the bond strength of a composite repair made with a bulk fill composite and a conventional one using different surface treatments. Specimens were prepared as truncated cones (bases: 4 mm × 2 mm, height: 4 mm) using a bulk fill (OBFa: Filtek One) or a conventional resin (FTKa: Filtek Z250) (n = 66). They were artificially aged (10,000 cycles, 5°C–55°C, 30 sec) and subdivided according to surface treatments: NT—no treatment (control), Abr—abrasion with a diamond tip, and sand—sandblasting with aluminum oxide (50 μm). Treatments were performed over the smaller diameter surface, followed by adhesive (Scothbond Universal) application. A new specimen with similar dimensions was constructed over it using either the OBF or the FTK, totaling 12 groups (n = 11). Bond strength was assessed by tensile test. The data were submitted to two-way ANOVA separately for OBFa and FTKa, followed by Tukey’s test ( p < 0.05 ). For the aged OBFa groups, there was significant differences for composite type and surface treatment, with higher values of bond strength when repaired with the same material (OBFa/OBF > OBFa/FTK), and sandblasting and bur abrasion presented higher values compared to the control group (NT). For the aged FTKa groups, there were no differences for the composite or surface treatment. Therefore, the bulk fill resin composite tested present better repair performance when the same composite was used, while the conventional resin composite was less influenced by the material and the surface treatment performed.

Study on the Bonding Mechanism and Bonding Performance of Double Layer Fine-Surfacing Technology

Double layer fine-surfacing technology is a thin layer maintenance technology of pavement positive texture, which plays an important role in preventing road safety accidents. Bonding performance is the key quality control index of the double layer fine-surfacing, which directly affects its service performance and durability. In this paper, the bonding mechanism of the double layer fine-surfacing is analyzed, and the bonding strength between the double layer fine-surfacing and the old asphalt pavement surface is studied by using the pullout test method under the factors of different cement dosage and different temperature environment, and the bonding index of the double layer fine-surfacing is put forward. Experiments show that the double layer fine-surfacing technology has the characteristics of super bonding and wear resistance. It is an economical and practical maintenance technology and has broad development prospects.