Relationships Between Sediment Mass-Failure Modes And Magnitudes In The Evolution Of The Scotian Slope, Offshore Nova Scotia

At 21.19 on 8 August 2017, an Ms 7.0 earthquake struck the Jiuzhaigou scenic spot in northwestern Sichuan Province, China. The Jiuzhaigou earthquake is a strike-slip earthquake with a focal depth of 20 km at 33.20° N and 103.82° E, and was caused by two concealed faults. According to emergency investigations and remote sensing interpretations, the Jiuzhaigou earthquake triggered 1780 landslides, damaged one dam (Nuorilang Waterfall) and broke one dam (Huohua Lake). The landslides mainly occurred in the Rize Valley and Shuzheng Valley and in Jiuzhai Paradise. The landslides involved hanging wall and back-slope effects, and the slope angle, slope aspect, seismic faults and valley trend were obviously related to the occurrence of the landslides. Specifically, most of the landslides were shallow landslides, rockfalls and rock avalanches and were small in scale. The failure modes of landslides mainly include wedge rock mass failure, residual deposit failure, relaxed rock mass failure and weathered rock mass failure. The initial low stability of the dam coupled with the topographic effect, back-slope effect and excess pore water pressure led to damage to the Nuorilang Waterfall dam.

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Gas Hydrates and Submarine Sediment Mass Failure: A Case Study from Sackville Spur, Offshore Newfoundland

World Atlas of Submarine Gas Hydrates in Continental Margins ◽

10.1007/978-3-030-81186-0_25 ◽

2022 ◽

pp. 303-314

Author(s):

David C. Mosher ◽

Jane E. Hawken ◽

D. Calvin Campbell

Keyword(s):

Gas Hydrates ◽

Sediment Mass ◽

Mass Failure

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Scanning Electron Microscopy in Hybrid Microelectronics

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100092244 ◽

1976 ◽

Vol 34 ◽

pp. 456-457

Author(s):

S. Khadpe ◽

R. Faryniak

Keyword(s):

Integrated Circuits ◽

Thick Film ◽

Integrated Circuit ◽

Failure Modes ◽

Three Dimensional ◽

Circuit Components ◽

Hybrid Microcircuit ◽

Electrical Connections ◽

Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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