Development of thermal conductive sheet with low interfacial heat resistance

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000083-000088
Author(s):  
Masao Tomikawa ◽  
Akira Shimada ◽  
Yoichi Shinba
Keyword(s):  
Residual Stress ◽  
Heat Resistance ◽  
Conductive Filler ◽  
High Heat ◽  
Total Heat ◽  
Interfacial Resistance ◽  
Interface Heat

Abstract In order to reduce total heat resistance, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive filler and metal such as Cu or Al. The interfacial heat resistance was determined by dispersion of high heat conductive filler and interfacial residual stress. The good dispersed sheet shows lower interfacial resistance than poor dispersed sheet, The interfacial residual stress causes an poor contact to metal to make void in the interface. To consider the effect of those facts, we successfully developed the high thermal conductive sheet with extremely low interfacial resistance. The interface heat resistance is below 0,009W/C.

scholarly journals Clustering rooting for the high heat resistance of some CHNO energetic materials

FirePhysChem ◽  
2021 ◽  
Vol 1 (1) ◽  
pp. 8-20
Author(s):  
Xingyu Huo ◽  
Fanfan Wang ◽  
Liang Liang Niu ◽  
Ruijun Gou ◽  
Chaoyang Zhang
Keyword(s):  
Heat Resistance ◽  
Energetic Materials ◽  
High Heat ◽  
High Heat Resistance

scholarly journals Molecular Physiological Characterization of a High Heat Resistant Spore Forming Bacillus subtilis Food Isolate

2021 ◽  
Vol 9 (3) ◽  
pp. 667
Author(s):  
Zhiwei Tu ◽  
Peter Setlow ◽  
Stanley Brul ◽  
Gertjan Kramer
Keyword(s):  
Bacillus Subtilis ◽  
Heat Resistance ◽  
Dipicolinic Acid ◽  
Laboratory Strain ◽  
High Heat ◽  
High Heat Resistance ◽  
Vegetative Cells ◽  
Heat Resistant ◽  
Food Isolate ◽  
Wet Heat

Bacterial endospores (spores) are among the most resistant living forms on earth. Spores of Bacillus subtilis A163 show extremely high resistance to wet heat compared to spores of laboratory strains. In this study, we found that spores of B. subtilis A163 were indeed very wet heat resistant and released dipicolinic acid (DPA) very slowly during heat treatment. We also determined the proteome of vegetative cells and spores of B. subtilis A163 and the differences in these proteomes from those of the laboratory strain PY79, spores of which are much less heat resistant. This proteomic characterization identified 2011 proteins in spores and 1901 proteins in vegetative cells of B. subtilis A163. Surprisingly, spore morphogenic protein SpoVM had no homologs in B. subtilis A163. Comparing protein expression between these two strains uncovered 108 proteins that were differentially present in spores and 93 proteins differentially present in cells. In addition, five of the seven proteins on an operon in strain A163, which is thought to be primarily responsible for this strain’s spores high heat resistance, were also identified. These findings reveal proteomic differences of the two strains exhibiting different resistance to heat and form a basis for further mechanistic analysis of the high heat resistance of B. subtilis A163 spores.

P-57: A Transparent Plastic Film having Excellent Optical Properties and High Heat Resistance for Flexible Display Substrates

2006 ◽  
Vol 37 (1) ◽  
pp. 418 ◽  
Author(s):  
Yoshiaki Watanabe ◽  
Ken-ichi Makita ◽  
Yasuyoshi Fujii ◽  
Hisanori Okada ◽  
Naoto Obara ◽  
...  
Keyword(s):  
Optical Properties ◽  
Heat Resistance ◽  
High Heat ◽  
Plastic Film ◽  
High Heat Resistance ◽  
Flexible Display ◽  
Transparent Plastic

Palladium-catalyzed silation of adamantanedi- and triol, leading to adamantane–siloxane alternating polymers with high heat resistance

Polymer ◽  
2007 ◽  
Vol 48 (15) ◽  
pp. 4301-4304 ◽  
Author(s):  
Joji Ohshita ◽  
Koichi Hino ◽  
Ko Inata ◽  
Atsutaka Kunai ◽  
Takayuki Maehara
Keyword(s):  
Heat Resistance ◽  
High Heat ◽  
High Heat Resistance ◽  
Palladium Catalyzed

A high heat-resistance bioplastic foam with efficient electromagnetic interference shielding

2017 ◽  
Vol 323 ◽  
pp. 29-36 ◽  
Author(s):  
Cheng-Hua Cui ◽  
Ding-Xiang Yan ◽  
Huan Pang ◽  
Li-Chuan Jia ◽  
Xin Xu ◽  
...  
Keyword(s):  
Heat Resistance ◽  
Electromagnetic Interference ◽  
High Heat ◽  
High Heat Resistance ◽  
Electromagnetic Interference Shielding

scholarly journals Factors Contributing to Heat Resistance of Clostridium perfringens Endospores

2008 ◽  
Vol 74 (11) ◽  
pp. 3328-3335 ◽  
Author(s):  
Benjamin Orsburn ◽  
Stephen B. Melville ◽  
David L. Popham
Keyword(s):  
Cell Wall ◽  
Heat Resistance ◽  
Clostridium Perfringens ◽  
Food Poisoning ◽  
High Heat ◽  
Relative Importance ◽  
High Heat Resistance ◽  
Factors Affecting ◽  
Cooking Process ◽  
Determining Factors

ABSTRACT The endospores formed by strains of type A Clostridium perfringens that produce the C. perfringens enterotoxin (CPE) are known to be more resistant to heat and cold than strains that do not produce this toxin. The high heat resistance of these spores allows them to survive the cooking process, leading to a large number of food-poisoning cases each year. The relative importance of factors contributing to the establishment of heat resistance in this species is currently unknown. The present study examines the spores formed by both CPE+ and CPE− strains for factors known to affect heat resistance in other species. We have found that the concentrations of DPA and metal ions, the size of the spore core, and the protoplast-to-sporoplast ratio are determining factors affecting heat resistance in these strains. While the overall thickness of the spore peptidoglycan was found to be consistent in all strains, the relative amounts of cortex and germ cell wall peptidoglycan also appear to play a role in the heat resistance of these strains.

Magnetic Domain Structures and Magnetic Properties of Lightly Nd-Doped Sm–Co Magnets With High Squareness and High Heat Resistance

2019 ◽  
Vol 55 (2) ◽  
pp. 1-4 ◽  
Author(s):  
Hiroaki Machida ◽  
Teruhiko Fujiwara ◽  
Chieko Fujimoto ◽  
Yu Kanamori ◽  
Jun Tanaka ◽  
...  
Keyword(s):  
Magnetic Properties ◽  
Heat Resistance ◽  
Magnetic Domain ◽  
High Heat ◽  
High Heat Resistance ◽  
Domain Structures

scholarly journals C,N-codoped MoSi 2 ceramic with excellent heat resistance for microwaves absorption application

2020 ◽  
Vol 7 (7) ◽  
pp. 200740
Author(s):  
Zhiqian Yang ◽  
Chang Xu ◽  
Yilu Xia ◽  
Ziming Xiong
Keyword(s):  
Heat Resistance ◽  
Solid Phase ◽  
High Heat ◽  
Filler Loading ◽  
Solid Phase Reaction ◽  
Phase Reaction ◽  
Electromagnetic Absorption ◽  
Wide Range ◽  
Loading Ratio ◽  
The One

Microwave absorption (MA) materials with high heat resistance have a wide range of applications in many fields. In this work, a C,N-codoped MoSi 2 ceramic was prepared via a facile solid-phase reaction method and its MA properties was investigated. On the one hand, the results indicate that this ceramic possesses excellent heat resistance and the weight of the MoSi 2 is almost constant when the temperature is lower than 800°C. On the other hand, this ceramic shows good MA performance when the filler loading ratio increases to 30 vol%, the value of reflection loss (RL) could reach to −17.70 dB at 7.44 GHz with the thickness of 2.0 mm and the effective electromagnetic absorption bandwidth (RL below −10 dB) could reach to 1.88 GHz (9.28–11.16 GHz) with the thickness of 1.5 mm. Multi-polarization resonance loss is considered as the predominant attention mechanism on the MA performance of this MoSi 2 ceramic. This research provides a new idea for understanding resonance mechanism and greatly expands the application scope of MoSi 2 ceramic in MA area.

Polylactide porous biocomposites with high heat resistance by utilizing cellulose template-directed construction

Cellulose ◽  
2020 ◽  
Vol 27 (7) ◽  
pp. 3805-3819 ◽  
Author(s):  
Liang-Qing Zhang ◽  
Shu-Gui Yang ◽  
Yue Li ◽  
Hua-Dong Huang ◽  
Ling Xu ◽  
...  
Keyword(s):  
Heat Resistance ◽  
High Heat ◽  
High Heat Resistance
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