In order to dominate the lighting market, LED needs more electrical power to be driven for higher brightness, thereby increasing thermal power dissipation, which contributes to a high heat flux of 85W/cm2 within a recent typical high power LED chip. And the junction temperature has direct influence upon the light output efficiency, device life time, emitting wavelength and reliability of LED. Therefore, effective removal of heat to maintain a safe junction temperature is the key to meet the future flux per LED requirements. Compared with other individual thermal resistances along the thermal path, thermal design for much lower packaging thermal resistance is more critical to improve the performances of LED. In this paper, major present technical researches on packaging thermal management were analyzed for high power LED, and the advantages and shortcomings of these techniques were respectively summarized. Besides, some suggestions were provided for further research in this area.
Research on illumination uniformity of high-power LED array light source
