Thermal Management Issues of Rotors in Rotating Electrical Machines

1994 ◽  
Author(s):  
R. Ponnappan ◽  
J.E. Leland ◽  
J.E. Beam
Keyword(s):  
Thermal Management ◽  
Electrical Machines ◽  
Management Issues

Thermal Management Issues in Operational Data Centers: Computational Fluid Dynamics Analysis and Experimental Study

2017 ◽  
Vol 9 (3) ◽  
Author(s):  
Babak Fakhim ◽  
Srinarayana Nagarathinam ◽  
Steven W. Armfield ◽  
Masud Behnia
Keyword(s):  
Thermal Management ◽  
Data Center ◽  
Data Centers ◽  
Electricity Consumption ◽  
Field Measurements ◽  
Hot Air ◽  
Computational Fluid Dynamics Analysis ◽  
Higher Power ◽  
Operational Data ◽  
Management Issues

The increase in the number of data centers in the last decade, combined with higher power density racks, has led to a significant increase in the associated total electricity consumption, which is compounded by cooling inefficiencies. Issues, such as hot air recirculation in the data center room environment, provide substantial challenges in thermal manageability. Three operational data centers have been studied to identify the cooling issues. Field measurements of temperature were obtained and were compared to numerical simulations to evaluate the overall thermal behavior of the data centers and to identify the thermal issues.

The Development of an Integrated Fan and Heat Sink Solution for Thermal Management in Low Profile Applications

2006 ◽  
Author(s):  
Ed Walsh ◽  
Ronan Grimes
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Sinks ◽  
Portable Electronics ◽  
Low Profile ◽  
Convection Cooling ◽  
New Methodologies ◽  
Heat Sink Design ◽  
Management Issues

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.

scholarly journals Corrections to “Opportunities and Challenges of Utilizing Additive Manufacturing Approaches in Thermal Management of Electrical Machines”

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 62532-62532
Author(s):  
Payam Shams Ghahfarokhi ◽  
Andrejs Podgornovs ◽  
Ants Kallaste ◽  
Antonio J. Marques Cardoso ◽  
Anouar Belahcen ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Thermal Management ◽  
Electrical Machines
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