Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)
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Graphite fiber composites for CTE control in thermal management [packaging]

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670773 ◽

2002 ◽

Cited By ~ 4

Author(s):

J.C. Calder ◽

D.R. Harrigan ◽

W.C. Riley

Keyword(s):

Thermal Management ◽

Fiber Composites ◽

Graphite Fiber

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Microvias and flex-an enabling MCM-L technology

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670805 ◽

2002 ◽

Author(s):

J. Keating ◽

R. Larmouth

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A system level approach to a structured MCM design methodology

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670777 ◽

2002 ◽

Cited By ~ 1

Author(s):

E. Ringroot ◽

C. Truzzi ◽

E. Beyne

Keyword(s):

Design Methodology ◽

System Level

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Wirebonding: reinventing the process for MCMs

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670797 ◽

2002 ◽

Cited By ~ 5

Author(s):

H.K. Jr. Charles ◽

K.J. Mach ◽

R.L. Edwards ◽

S.J. Lehtonen ◽

D.M. Lee

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Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670768 ◽

2002 ◽

Cited By ~ 6

Author(s):

W.D. Brown ◽

A.P. Malshe ◽

T.A. Railkar ◽

T.G. Lenihan ◽

J.W. Stone ◽

...

Keyword(s):

Thermal Management ◽

Flexible Substrate ◽

3 Dimensional ◽

Management Issues

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The development of a top-bottom-BGA (TB-BGA)

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670788 ◽

2002 ◽

Cited By ~ 2

Author(s):

R. Leutenbauer ◽

V. Grosser ◽

B. Michel ◽

H. Reichl

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Flip chip MPU module on high performance printed circuit board "ALIVH"

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670835 ◽

2002 ◽

Cited By ~ 2

Author(s):

T. Shiraishi ◽

K. Amami ◽

Y. Bessho ◽

K. Sakamaoto ◽

K. Eda ◽

...

Keyword(s):

High Performance ◽

Flip Chip ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit

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Test methods used to produce highly reliable known good die (KGD)

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670811 ◽

2002 ◽

Cited By ~ 3

Author(s):

R. Arnold ◽

S.M. Menon ◽

B. Brackett ◽

R. Richmond

Keyword(s):

Test Methods ◽

Known Good Die

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Trends in BGA design methodologies

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670789 ◽

2002 ◽

Author(s):

K. Rinebold

Keyword(s):

Design Methodologies

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Precision copper pattern plating on ceramic for high performance MCMs

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670821 ◽

2002 ◽

Author(s):

L. Balents ◽

K. Christopher ◽

J. Morrison ◽

D. Skoczylas

Keyword(s):

High Performance

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Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Graphite fiber composites for CTE control in thermal management [packaging]

Microvias and flex-an enabling MCM-L technology

A system level approach to a structured MCM design methodology

Wirebonding: reinventing the process for MCMs

Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept

The development of a top-bottom-BGA (TB-BGA)

Flip chip MPU module on high performance printed circuit board "ALIVH"

Test methods used to produce highly reliable known good die (KGD)

Trends in BGA design methodologies

Precision copper pattern plating on ceramic for high performance MCMs

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)
Latest Publications