Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Plastic Composite Substrates.

Circuit Technology ◽

10.5104/jiep1986.8.14 ◽

1993 ◽

Vol 8 (1) ◽

pp. 14-17

Author(s):

Kiyotaka TSUKADA

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Plastic Composite ◽

Composite Substrates

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Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards

2017 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2017.7939449 ◽

2017 ◽

Author(s):

Tae-Ik Lee ◽

Cheolgyu Kim ◽

Jae-Bum Pyo ◽

Min Sung Kim ◽

Taek-Soo Kim

Keyword(s):

Mechanical Properties ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Woven Composite ◽

Printed Circuit ◽

Anisotropic Mechanical Properties ◽

Composite Substrates

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Personal Computer.

Circuit Technology ◽

10.5104/jiep1986.9.76 ◽

1994 ◽

Vol 9 (2) ◽

pp. 76-82

Author(s):

Mitsuo SAITOU ◽

Makoto GOSHIMA

Keyword(s):

Personal Computer ◽

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

Future Utilization ◽

Advanced Applications

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Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Trends of Malti Layer PWB Meeting Down-sizing.

Circuit Technology ◽

10.5104/jiep1986.8.9 ◽

1993 ◽

Vol 8 (1) ◽

pp. 9-13

Author(s):

Kuniaki KUWAJIMA

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

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Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Future of Electric Components.

Circuit Technology ◽

10.5104/jiep1986.8.6 ◽

1993 ◽

Vol 8 (1) ◽

pp. 6-8

Author(s):

Kenzo HATADA

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. The Development Trend of Materials for Advanced Multilayer-PWB.

Circuit Technology ◽

10.5104/jiep1986.9.70 ◽

1994 ◽

Vol 9 (2) ◽

pp. 70-75

Author(s):

Tsuyoshi MATSUMOTO ◽

Hiroyuki KOBAYASHI

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

Development Trend ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

The Development Trend

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Video Movie.

Circuit Technology ◽

10.5104/jiep1986.9.94 ◽

1994 ◽

Vol 9 (2) ◽

pp. 94-98

Author(s):

Nobuyuki NISHITANI

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

Future Utilization ◽

Advanced Applications

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Portable Telephone.

Circuit Technology ◽

10.5104/jiep1986.9.83 ◽

1994 ◽

Vol 9 (2) ◽

pp. 83-87

Author(s):

Takumi FURUKAWA

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

Future Utilization ◽

Advanced Applications

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Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Future Trend of EMI Controlled Printed Wiring Boards.

Circuit Technology ◽

10.5104/jiep1986.8.18 ◽

1993 ◽

Vol 8 (1) ◽

pp. 18-22

Author(s):

Yoshiharu TAMURA

Keyword(s):

Printed Circuit Boards ◽

Future Trend ◽

Circuit Boards ◽

Printed Wiring Boards ◽

Printed Circuit ◽

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Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Future of Mount Density of PWB.

Circuit Technology ◽

10.5104/jiep1986.8.1 ◽

1993 ◽

Vol 8 (1) ◽

pp. 1-5 ◽

Author(s):

Hiroshi TAKAMIZAWA

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

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Wood Plastic Composite Produced by Nonmetals from Pulverized Waste Printed Circuit Boards

Environmental Science & Technology ◽

10.1021/es902889b ◽

2010 ◽

Vol 44 (1) ◽

pp. 463-468 ◽

Author(s):

Jie Guo ◽

Yinen Tang ◽

Zhenming Xu

Keyword(s):

Printed Circuit Boards ◽

Wood Plastic Composite ◽

Circuit Boards ◽

Printed Circuit ◽

Plastic Composite ◽

Waste Printed Circuit Boards

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