Reliability Improvement of the Electronic Security Fence Using Friction Electricity Sensor by Analyzing Frequency Characteristic of Environmental Noise Signal

Author(s):  
Seok Jin Yun ◽  
Seo Yeon Won ◽  
Hie Sik Kim ◽  
Young Chul Lee ◽  
Woo Young Jang
2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon

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