Reliability Improvement of the Electronic Security Fence Using Friction Electricity Sensor by Analyzing Frequency Characteristic of Environmental Noise Signal

2015 ◽  
Vol 52 (3) ◽  
pp. 173-180
Author(s):  
Seok Jin Yun ◽  
Seo Yeon Won ◽  
Hie Sik Kim ◽  
Young Chul Lee ◽  
Woo Young Jang
Keyword(s):  
Frequency Characteristic ◽  
Environmental Noise ◽  
Noise Signal ◽  
Reliability Improvement

Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  
Keyword(s):  
Protection System ◽  
Feeding System ◽  
Reliability Improvement ◽  
Ground Fault ◽  
Fault Protection ◽  
Ground Fault Protection

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

Ka-Band Reliability Improvement. Part I. Volume III. Ka-Band SATCOM Set Analysis. Appendix C

1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon
Keyword(s):  
Ka Band ◽  
Reliability Improvement
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