An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages
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Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.
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2009 ◽
Vol E92-C
(3)
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pp. 327-333
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2016 ◽
Vol 53
(5)
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pp. 727-739
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2009 ◽
Vol 10
(6)
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pp. 743-752
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2013 ◽
Vol 15
(2)
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pp. 29-36
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2012 ◽
2018 ◽
Vol 2
(Special edition 2)
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pp. 123-132
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2020 ◽
Vol 11
(1)
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pp. 14-30
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