Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

JSTS Journal of Semiconductor Technology and Science ◽

10.5573/jsts.2011.11.1.015 ◽

2011 ◽

Vol 11 (1) ◽

pp. 15-22 ◽

Author(s):

Hye-Won Kim ◽

Dong-Chul Kim ◽

Yung-Seon Eo

Keyword(s):

Signal Integrity ◽

Experimental Characterization ◽

Integrity Verification ◽

Interconnect Lines

Download Full-text

Analytical Eye-Diagram Determination for the Efficient and Accurate Signal Integrity Verification of Coupled Interconnect Lines

JSTS Journal of Semiconductor Technology and Science ◽

10.5573/jsts.2013.13.6.594 ◽

2013 ◽

Vol 13 (6) ◽

pp. 594-607

Author(s):

Minji Lee ◽

Dongchul Kim ◽

Yungseon Eo

Keyword(s):

Signal Integrity ◽

Eye Diagram ◽

Integrity Verification ◽

Interconnect Lines

Download Full-text

Signal integrity verification of coupled interconnect lines using efficient eye-diagram determination

Proceedings of 2010 IEEE International Symposium on Circuits and Systems ◽

10.1109/iscas.2010.5537774 ◽

2010 ◽

Author(s):

Dongchul Kim ◽

Hyewon Kim ◽

Yungseon Eo

Keyword(s):

Signal Integrity ◽

Eye Diagram ◽

Integrity Verification ◽

Interconnect Lines

Download Full-text

Analytical Eye-Diagram Determination for the Efficient and Accurate Signal Integrity Verification of Single Interconnect Lines

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ◽

10.1109/tcad.2012.2196277 ◽

2012 ◽

Vol 31 (10) ◽

pp. 1536-1545 ◽

Author(s):

Dongchul Kim ◽

Hyewon Kim ◽

Yungseon Eo

Keyword(s):

Signal Integrity ◽

Eye Diagram ◽

Integrity Verification ◽

Interconnect Lines

Download Full-text

Signal Integrity verification of Coplanar Structures for shielded on-chip interconnect lines

2009 International SoC Design Conference (ISOCC) ◽

10.1109/socdc.2009.5423861 ◽

2009 ◽

Author(s):

Zafar Bedar Khan ◽

Hyewon Kim ◽

Yungseon Eo

Keyword(s):

Signal Integrity ◽

Integrity Verification ◽

On Chip ◽

Interconnect Lines

Download Full-text

Efficient Signal Integrity Verification Method of Multi-Coupled RLC Interconnect Lines with Asynchronous Circuit Switching

7th International Symposium on Quality Electronic Design (ISQED'06) ◽

10.1109/isqed.2006.57 ◽

2006 ◽

Author(s):

Taeyong Je ◽

Yungseon Eo

Keyword(s):

Signal Integrity ◽

Circuit Switching ◽

Asynchronous Circuit ◽

Verification Method ◽

Integrity Verification ◽

Interconnect Lines

Download Full-text

Compact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines

IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences ◽

10.1587/transfun.e93.a.752 ◽

2010 ◽

Vol E93.A (4) ◽

pp. 752-760

Author(s):

Hyunsik KIM ◽

Yungseon EO

Keyword(s):

Transmission Lines ◽

Signal Integrity ◽

Integrity Verification ◽

Coupled Transmission Lines

Download Full-text

A cooperative research for experimental characterization of signal integrity in deep submicron integrated circuits

1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) ◽

10.1109/isemc.1999.812928 ◽

2003 ◽

Author(s):

E. Sicard ◽

S. Delmas ◽

F. Caignet ◽

R. De Smedt ◽

T. Steinecke ◽

...

Keyword(s):

Integrated Circuits ◽

Signal Integrity ◽

Deep Submicron ◽

Experimental Characterization ◽

Cooperative Research

Download Full-text

Virtual signal-integrity verification tool for copper twisted-pairs using TDR

IET Science Measurement & Technology ◽

10.1049/iet-smt.2018.5057 ◽

2019 ◽

Vol 13 (2) ◽

pp. 231-237

Author(s):

Teong Chee Chuah ◽

Yin Hoe Ng ◽

Nabihah Hashim ◽

Ahmadun Nijar Zainal Abidin ◽

Azhari Asrokin

Keyword(s):

Signal Integrity ◽

Integrity Verification ◽

Verification Tool ◽

Download Full-text

Jitter and Signal Integrity Verification for Synchronous and Asynchronous I/Os at Multiple to 10 GHz/Gbps

2008 IEEE International Test Conference ◽

10.1109/test.2008.4700649 ◽

2008 ◽

Author(s):

M.P. Li

Keyword(s):

Signal Integrity ◽

Integrity Verification

Download Full-text

VLSI: An investigation into electromagnetic signatures (EMS) for non-invasive testing and signal-integrity verification

East-West Design & Test Symposium (EWDTS 2013) ◽

10.1109/ewdts.2013.6673146 ◽

2013 ◽

Author(s):

HJ Kadim ◽

L. M. Coulibaly

Keyword(s):

Signal Integrity ◽

Integrity Verification ◽

Download Full-text