scholarly journals THE EFFECTS OF RADIAL HEAT SINK GEOMETRY AND SURFACE COATINGS ON THE LED COOLING PERFORMANCE FOR HIGH POWER LED LAMP

2013 ◽  
Vol 18 (1) ◽  
pp. 63-68
Author(s):  
H.S. Kim ◽  
S.H. Park ◽  
D. Kim ◽  
K. Kim
Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3958
Author(s):  
Jianhua Xiang ◽  
Zeyu Liu ◽  
Chunliang Zhang ◽  
Chao Zhou ◽  
Conggui Chen

A phase change heat sink has higher heat transfer efficiency compared to a traditional metal solid heat sink, and is thus more preferred for the heat dissipation of high-power light-emitting diodes (LEDs) with very high heat flux. The boiling structure at the evaporation surface is the biggest factor that affects heat sink resistance. It is necessary to investigate the plastic deformation law during the machining process of boiling structures. In this study, a novel phase change radial heat sink was developed for high-power LED heat dissipation. First, a working principle and a fabrication process for the heat sink were introduced. Subsequently, to achieve an excellent heat dissipation performance, the machining process of boiling structures was numerically simulated and investigated. To be specific, plastic deformation generated during the formation was analyzed, and key parameters related to the morphology of the boiling structures were discussed including feeding angles and machining depths. Moreover, the finite element (FE) simulation results were compared with those of experiments. Last but not least, the heat transfer performance of the fabricated heat sink was tested. Results showed that the developed heat sink was well suited for a high-power LED application.


2011 ◽  
Vol 32 (11) ◽  
pp. 1171-1175 ◽  
Author(s):  
柴伟伟 CHAI Wei-wei ◽  
陈清华 CHEN Qing-hua ◽  
李琳红 LI Ling-hong ◽  
唐文勇 TANG Wen-yong ◽  
张学清 ZHANG Xue-qing ◽  
...  

2012 ◽  
Vol 49 (10) ◽  
pp. 102201 ◽  
Author(s):  
李中 Li Zhong ◽  
李勇 Li Yong ◽  
汤应戈 Tang Yingge ◽  
林樵健 Lin Qiaojian

2011 ◽  
Vol 21 (9) ◽  
pp. 2066-2071 ◽  
Author(s):  
Jian-hua XIANG ◽  
Chun-liang ZHANG ◽  
Fan JIANG ◽  
Xiao-chu LIU ◽  
Yong TANG

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.


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