A Study on Thermoelastic Interaction in a Poroelastic Medium with and without Energy Dissipation

In the current work, a new generalized model of heat conduction has been constructed taking into account the influence of porosity on a poro-thermoelastic medium using the finite element method (FEM). The governing equations are presented in the context of the Green and Naghdi (G-N) type III theory with and without energy dissipations. The finite element scheme has been adopted to present the solutions due to the complex formulations of this problem. The effects of porosity on poro-thermoelastic material are investigated. The numerical results for stresses, temperatures, and displacements for the solid and the fluid are graphically presented. This work provides future investigators with insight regarding details of non-simple poro-thermoelasticity with different phases.

Photo-Thermal Interactions in a Semiconducting Media with a Spherical Cavity under Hyperbolic Two-Temperature Model

This article highlights the study of photo-thermoelastic interaction in an unbounded semiconductor medium containing a spherical cavity. This problem is solved using the new hyperbolic two-temperature model. The bounding surface of the cavity is traction free and loaded thermally by exponentially decaying pulse boundary heat flux. In addition, the carrier density is prescribed on the inner surface of the cavity in terms of the recombination speed. The techniques of Laplace transforms are used to get the analytical solutions of the problem in the transformed domain by the eigenvalues method. The inversions of Laplace transformations have been carried out numerically. The outcomes also display that the analytical schemes can overcome the mathematical problem to analyze this problem. Numerical outcomes for a semiconductor material are performed and demonstrated graphically. According to the numerical results, this new hyperbolic two-temperature model of thermoelasticity offers finite speed of the thermal wave and mechanical wave propagation.