A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications

This paper proposes a system in package (SiP) for ultrasonic ranging composed of a 4 × 8 matrix of piezoelectric micromachined ultrasonic transducers (PMUT) and an interface integrated circuit (IC). The PMUT matrix is fabricated using the PiezoMUMPS process and the IC is implemented in the AMS 0.35 µm technology. Simulation results for the PMUT are compared to the measurement results, and an equivalent circuit has been derived to allow a better approximation of the load of the PMUT on the IC. The control circuit is composed of a high-voltage pulser to drive the PMUT for transmission and of a transimpedance amplifier to amplify the received echo. The working frequency of the system is 1.5 MHz.

CONSTRUCTION OF AN ULTRASONIC TOMOGRAPH FOR ANALYSIS OF TECHNOLOGICAL PROCESSES IN THE FIELD OF REFLECTION AND TRANSMISSION WAVES

This article presents the ultrasonic structure for the analysis of technological processes in the field of reflective and transmission waves. Ultrasound tomography enables the analysis of processes occurring in the examined object without interfering with its interior through appropriate acquisition and analysis of data. The design goal is to verify the repeatability of measurement results by eliminating laboratory equipment. The ultrasonic tomograph has been designed in a modular way and consists of a motherboard connected to an analog signal conditioning board, a liquid crystal display with an integrated graphics processor and a high voltage pulser with a 64 channel multiplexer. The solution was designed for tomographic measurements of technological process properties.