gypsum particleboard
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InCIEC 2015 ◽  
2016 ◽  
pp. 797-805
Author(s):  
A. A. G. Halim ◽  
H. Shaharin ◽  
N. S. Aini ◽  
M. A. Fadzil

2011 ◽  
Vol 25 (7) ◽  
pp. 3044-3050 ◽  
Author(s):  
Byoung-Ho Lee ◽  
Hee-Soo Kim ◽  
Sumin Kim ◽  
Hyun-Joong Kim ◽  
Bongwoo Lee ◽  
...  

Holzforschung ◽  
2008 ◽  
Vol 62 (3) ◽  
Author(s):  
Yuhe Deng ◽  
Jiayan Luo ◽  
Dexing Zai ◽  
Ling Xuan ◽  
Zhenghua Han ◽  
...  

2007 ◽  
Vol 22 (1) ◽  
pp. 44-47 ◽  
Author(s):  
Qian Feng ◽  
Yuhe Deng ◽  
Hyunjoong Kim ◽  
Wen Lei ◽  
Zhiwu Sun ◽  
...  
Keyword(s):  

2006 ◽  
Vol 16 ◽  
pp. s361-s364 ◽  
Author(s):  
Wen LEI ◽  
Yu-he DENG ◽  
Mei ZHOU ◽  
Ling XUAN ◽  
Qian FENG

Holzforschung ◽  
2006 ◽  
Vol 60 (3) ◽  
pp. 318-321 ◽  
Author(s):  
Yuhe Deng ◽  
Ling Xuan ◽  
Qian Feng

Abstract This paper describes the influence of the addition of an organosilicon waterproof agent on the properties of gypsum particleboard (GPB). Test results showed that the additive at an appropriate concentration reduces the thickness swelling (TS) and water absorption (WA), and increases the mechanical properties. TS was lowered to ∼1.6% and internal bond strength (IB) was increased to ∼0.4 MPa when 3% organosilicon agent was added. Accordingly, the TS was reduced by 53% and the IB increased by 45% relative to control board without additives. The modulus of rupture (MOR) and modulus of elasticity (MOE) were also increased in the presence of the organosilicon waterproof agent. The effect was pronounced for MOR. On the other hand, too high a content of organosilicon additive had a negative effect and the corresponding property values were poorer. X-Ray diffraction revealed that the content of gypsum dihydrate increased in the presence of the additive, but other chemical changes were not observed. Scanning electron microscopy (SEM) confirmed that the crystal size in gypsum was reduced is the presence of the additive.


2001 ◽  
Vol 47 (6) ◽  
pp. 445-450 ◽  
Author(s):  
Yu-He Deng ◽  
Takeshi Furuno

2001 ◽  
Vol 47 (5) ◽  
pp. 356-361 ◽  
Author(s):  
Yu-He Deng ◽  
Takeshi Furuno ◽  
Yu-Fei Wu

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