High Density Design Packaging and Microsystem Integration, 2007 International Symposium on
Latest Publications

TOTAL DOCUMENTS

109

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H-INDEX

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Published By IEEE

1424412528, 1424412536

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The Design of a Developed PWM DC-DC Converter

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283642 ◽

2007 ◽

Author(s):

Wang Xichuan ◽

Zhang ting ◽

Deng Huan

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Analytical Model of the Electrostatic Scratch Drive Actuator

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283653 ◽

2007 ◽

Author(s):

Yu Maohua ◽

Wang Xiaojing ◽

Xie Mingchun ◽

Wang Guoliang ◽

Zhang Minliang

Keyword(s):

Analytical Model

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Technology of Stacking Vertical Interconnecting Micro-Assembly

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283566 ◽

2007 ◽

Cited By ~ 3

Author(s):

Zhang Bao ◽

Wang Zhong ◽

Wang Xiangjun

Keyword(s):

Micro Assembly

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A Pipeline Sliding Window Max-Log-Map Turbo Decoder

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283631 ◽

2007 ◽

Author(s):

Ming Li ◽

Ming-ming Peng ◽

Jing-sai Jiang ◽

Fa-yu Wan

Keyword(s):

Sliding Window ◽

Turbo Decoder ◽

Log Map

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A Method to Model MOSFET's Second Breakdown Action for Circuit-Level ESD Simulation

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283600 ◽

2007 ◽

Cited By ~ 1

Author(s):

Qiang Cui ◽

Yan Han ◽

Juin J. Liou ◽

Shurong Dong ◽

Ruijun Si ◽

...

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Lead Determination by Microwave-Assisted Inductively Coupled Plasma Optical Emission Spectrometry for RoHS Compliance

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283604 ◽

2007 ◽

Author(s):

L. Hua ◽

Y.P. Wu ◽

B. An ◽

F.S. Wu

Keyword(s):

Inductively Coupled Plasma ◽

Optical Emission ◽

Optical Emission Spectrometry ◽

Emission Spectrometry ◽

Lead Determination ◽

Inductively Coupled ◽

Microwave Assisted ◽

Plasma Optical Emission Spectrometry

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Modeling and Compensating of Piezoelectric Actuator Hysteresis in Photolithography

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283614 ◽

2007 ◽

Cited By ~ 2

Author(s):

Li Zhan-hui ◽

Wu Yun-xin ◽

Deng Xi-shu

Keyword(s):

Piezoelectric Actuator

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Integrating ADC IP in a SoC and Its Verification

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283634 ◽

2007 ◽

Cited By ~ 2

Author(s):

Yueli Hu ◽

Wenyi Jing ◽

Ying Liu

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Material Systems Enable High Density Packaging

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283548 ◽

2007 ◽

Cited By ~ 1

Author(s):

Michael Todd

Keyword(s):

High Density ◽

Material Systems ◽

High Density Packaging

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Research on Modelling and Controlling for Active Vibration-isolation System on Testing Equipment of Stepping and Scanning Lithography

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283615 ◽

2007 ◽

Cited By ~ 1

Author(s):

Deng Xi-shu ◽

Wu Yun-xin

Keyword(s):

Vibration Isolation ◽

Testing Equipment ◽

Isolation System ◽

Vibration Isolation System ◽

Active Vibration ◽

Active Vibration Isolation

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High Density Design Packaging and Microsystem Integration, 2007 International Symposium onLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

The Design of a Developed PWM DC-DC Converter

Analytical Model of the Electrostatic Scratch Drive Actuator

Technology of Stacking Vertical Interconnecting Micro-Assembly

A Pipeline Sliding Window Max-Log-Map Turbo Decoder

A Method to Model MOSFET's Second Breakdown Action for Circuit-Level ESD Simulation

Lead Determination by Microwave-Assisted Inductively Coupled Plasma Optical Emission Spectrometry for RoHS Compliance

Modeling and Compensating of Piezoelectric Actuator Hysteresis in Photolithography

Integrating ADC IP in a SoC and Its Verification

Material Systems Enable High Density Packaging

Research on Modelling and Controlling for Active Vibration-isolation System on Testing Equipment of Stepping and Scanning Lithography

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on
Latest Publications