ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection
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Published By American Chemical Society

0841216797, 0841212635

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Novel Coatings That Maintain Low Surface-Water Concentrations

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch027 ◽

1989 ◽

pp. 337-343

Author(s):

James E. Anderson ◽

V. Markovac ◽

I. Kim ◽

Philip R. Troyk

Keyword(s):

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Curing of Binary Mixtures of Polyimides

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch010 ◽

1989 ◽

pp. 114-126 ◽

Author(s):

C. Feger

Keyword(s):

Binary Mixtures

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Ultraviolet-Curable Silicones for Integrated-Circuit Protection

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch024 ◽

1989 ◽

pp. 275-283 ◽

Author(s):

Michael A. Lutz ◽

Kristen A. Scheibert

Keyword(s):

Integrated Circuit ◽

Ultraviolet Curable

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Dielectric Characterization of Water in Polyimide and Poly(amide—imide) Thin Films

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch005 ◽

1989 ◽

pp. 67-76

Author(s):

Allyson J. Beuhler ◽

Neal R. Nowicki ◽

Joanne M. Gaudette

Keyword(s):

Dielectric Characterization

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Polyimides for Dielectric Layers

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch011 ◽

1989 ◽

pp. 127-139 ◽

Author(s):

L. M. Baker ◽

P. J. Brown ◽

J. L. Markham

Keyword(s):

Dielectric Layers

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Stress Factors in Molding Compounds

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch030 ◽

1989 ◽

pp. 375-383

Author(s):

A. A. Gallo

Keyword(s):

Stress Factors ◽

Molding Compounds

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Cure Studies of PMDA-ODA- and BTDA-ODA-Based Polyimides by Fluorescence Spectroscopy

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch002 ◽

1989 ◽

pp. 26-48 ◽

Author(s):

Eric D. Wachsman ◽

Peter S. Martin ◽

Curtis W. Frank

Keyword(s):

Fluorescence Spectroscopy

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Subject Index

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ix002 ◽

1989 ◽

pp. 487-499

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High-Performance Silicone Gel as Integrated-Circuit-Device Chip Protection

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch019 ◽

1989 ◽

pp. 220-229 ◽

Author(s):

C. P. Wong

Keyword(s):

Integrated Circuit ◽

High Performance ◽

Silicone Gel ◽

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Enhancement of Gold—Aluminum Wirebond Reliability in Plastic Encapsulated Very Large Scale Integration (VLSI) Devices Through C—Br Bond Stabilization

ACS Symposium Series - Polymeric Materials for Electronics Packaging and Interconnection ◽

10.1021/bk-1989-0407.ch036 ◽

1989 ◽

pp. 429-443

Author(s):

Muhib M. Khan ◽

Homi Fatemi ◽

Jeremias Romero ◽

Eugene Delenia

Keyword(s):

Large Scale ◽

Very Large Scale Integration ◽

Large Scale Integration ◽

Scale Integration

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