Frontiers in Electronic Testing - Multi-Chip Module Test Strategies
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Published By Springer US

9781461377986, 9781461561071

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Electron Beam Probing—A Solution for MCM Test and Failure Analysis

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_5 ◽

1997 ◽

pp. 55-63

Author(s):

R. Schmid ◽

R. Schmitt ◽

M. Brunner ◽

O. Gessner ◽

M. Sturm ◽

...

Keyword(s):

Electron Beam ◽

Failure Analysis

A Survey of Test Techniques for MCM Substrates

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_3 ◽

1997 ◽

pp. 27-38 ◽

Cited By ~ 2

Author(s):

Madhavan Swaminathan ◽

Bruce Kim ◽

Abhijit Chatterjee ◽

Y. Zorian

Fundamentals of MCM Testing and Design-for-Testability

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_1 ◽

1997 ◽

pp. 7-14 ◽

Cited By ~ 2

Author(s):

Yervant Zorian ◽

V. D. Agrawal

Keyword(s):

Design For Testability ◽

Mcm Testing

Design-for-Test in a Multiple Substrate Multichip Module

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_9 ◽

1997 ◽

pp. 97-108

Author(s):

Joel A. Jorgenson ◽

Russell J. Wagner ◽

Y. Zorian

Keyword(s):

Multichip Module ◽

Design For Test ◽

Multiple Substrate

Known Good Die

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_2 ◽

1997 ◽

pp. 15-25 ◽

Cited By ~ 1

Author(s):

Larry Gilg ◽

Y. Zorian

Keyword(s):

Known Good Die

Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_7 ◽

1997 ◽

pp. 77-86 ◽

Cited By ~ 3

Author(s):

Najmi Jarwala ◽

Y. Zorian

Keyword(s):

Ieee 1149.1

Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_14 ◽

1997 ◽

pp. 151-166

Author(s):

Cynthia F. Murphy ◽

Magdy S. Abadir ◽

Peter A. Sandborn ◽

Y. Zorian

Keyword(s):

Economic Analysis ◽

Multichip Modules ◽

Known Good Die ◽

Test Process

Simulation Techniques for the Manufacturing Test of MCMs

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_13 ◽

1997 ◽

pp. 137-149

Author(s):

Mick Tegethoff ◽

Tom Chen ◽

Y. Zorian

Keyword(s):

Simulation Techniques ◽

Manufacturing Test

Multichip Module Diagnosis by Product-Code Signatures

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_12 ◽

1997 ◽

pp. 127-135

Author(s):

P. Nagvajara ◽

J. Lin ◽

P. Nilagupta ◽

C. Wang ◽

Y. Zorian

Keyword(s):

Multichip Module ◽

Product Code

An Effective Multi-Chip BIST Scheme

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_8 ◽

1997 ◽

pp. 87-95

Author(s):

Yervant Zorian ◽

Hakim Bederr ◽

V. D. Agrawal

Frontiers in Electronic Testing - Multi-Chip Module Test StrategiesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Electron Beam Probing—A Solution for MCM Test and Failure Analysis

A Survey of Test Techniques for MCM Substrates

Fundamentals of MCM Testing and Design-for-Testability

Design-for-Test in a Multiple Substrate Multichip Module

Known Good Die

Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules

Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

Simulation Techniques for the Manufacturing Test of MCMs

Multichip Module Diagnosis by Product-Code Signatures

An Effective Multi-Chip BIST Scheme

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies
Latest Publications