Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls

2022 ◽  
pp. 1-1
Author(s):  
Kaixuan Song ◽  
Jinchun Gao ◽  
George T. Flowers ◽  
Ziren Wang ◽  
Wei Yi ◽  
...  
Keyword(s):  
Signal Integrity ◽  
Ball Grid Array ◽  
Modeling And Analysis ◽  
Solder Balls ◽  
Ball Grid Array Packages

Electrical resistance of Sn–Ag–Cu ball grid array packages with Sn–Zn–Bi addition jointed at 240 °C

2007 ◽  
Vol 22 (1) ◽  
pp. 113-123
Author(s):  
Po-Cheng Shih ◽  
Kwang-Lung Lin
Keyword(s):  
Control System ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Electrical Resistance ◽  
Ball Grid Array ◽  
Solder Paste ◽  
Solder Balls ◽  
Solder Bulk ◽  
Ball Grid Array Packages

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously at 240 °C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn–Zn–Bi addition (only Sn–Ag–Cu) were studied as a control system. Electrical resistance was measured after multiple reflows and aging. The electrical resistance of the joint (R1) consisted of three parts: the solder bulk (Rsolder bulk, upper solder highly beyond the mask), interfacial solder/intermetallic compound (Rsolder/IMC), and the substrate (Rsubstrate). R1 increased with reflows and aging time. Rsolder/IMC, rather than Rsolder bulk and Rsubstrate, seemed to increase with reflows and aging time. The increase of R1 was ascribed to the Rsolder/IMC rises. Rsubstrate was the major contribution to R1. However Rsolder/IMC dominated the increase of R1 with reflows and aging. R1 of Sn–Zn–Bi/Sn–Ag–Cu samples were higher than that of Sn–Ag–Cu samples in various tests.

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

1999 ◽  
Vol 121 (4) ◽  
pp. 242-248 ◽  
Author(s):  
J. Lau ◽  
T. Chen ◽  
S.-W. R. Lee
Keyword(s):  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Circuit Board ◽  
Cooling Power ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Balls ◽  
Ball Grid Array Packages

The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls.

Impact of the Ball Grid Array Connection Failures on Signal Integrity

2020 ◽  
Author(s):  
Kaixuan Song ◽  
Jinchun Gao ◽  
George T. Flowers ◽  
Ziren Wang ◽  
Qingya Li ◽  
...  
Keyword(s):  
Signal Integrity ◽  
Ball Grid Array

Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes

2015 ◽  
Vol 5 (6) ◽  
pp. 828-837 ◽  
Author(s):  
Zhou Hai ◽  
Jiawei Zhang ◽  
Chaobo Shen ◽  
John L. Evans ◽  
Michael J. Bozack ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Surface Finishes ◽  
Fine Pitch ◽  
Ball Grid Array Packages
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