2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992652 ◽

2017 ◽

Keyword(s):

Back Cover

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An area-scalable two-layer evaporator wick concept for high-heat-flux vapor chambers

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992520 ◽

2017 ◽

Cited By ~ 2

Author(s):

Srivathsan Sudhakar ◽

Justin A. Weibel ◽

Suresh V. Garimella

Keyword(s):

Heat Flux ◽

High Heat ◽

High Heat Flux

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Thermal analysis of white light-emitting diodes structures with hybrid quantum dots/phosphor layer

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992596 ◽

2017 ◽

Author(s):

Bin Xie ◽

Yanhua Cheng ◽

Junjie Hao ◽

Xingjian Yu ◽

Qi Chen ◽

...

Keyword(s):

Thermal Analysis ◽

Quantum Dots ◽

White Light ◽

Light Emitting Diodes ◽

Phosphor Layer ◽

Light Emitting ◽

White Light Emitting Diodes

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Effect of subcooling, flow rate and surface characteristics on flow boiling performance of high performance liquid cooled immersion server model

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992582 ◽

2017 ◽

Author(s):

Sriram Chandrasekaran ◽

Joshua Gess ◽

Sushil Bhavnani

Keyword(s):

Flow Rate ◽

High Performance ◽

Flow Boiling ◽

Surface Characteristics

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Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992630 ◽

2017 ◽

Author(s):

Pradeep Lall ◽

Shantanu Deshpande ◽

Luu Nguyen

Keyword(s):

Extreme Environments ◽

High Current

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Towards using nanoelectrospray for evaporative heat transfer enhancement

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7991851 ◽

2017 ◽

Cited By ~ 1

Author(s):

Joel D. Chapman ◽

Peter A. Kottke ◽

Andrei G. Fedorov

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Transfer Enhancement ◽

Evaporative Heat Transfer

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Investigation of thermal transport across solid interfaces with randomly distributed nanostructures

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992495 ◽

2017 ◽

Author(s):

Eungkyu Lee ◽

Tengfei Luo

Keyword(s):

Thermal Transport

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Parametric study of liquid-vapor interface within a woven metallic wire mesh screen

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992466 ◽

2017 ◽

Author(s):

Karthik S. Remella ◽

Frank M. Gerner

Keyword(s):

Parametric Study ◽

Wire Mesh ◽

Metallic Wire ◽

Vapor Interface ◽

Mesh Screen ◽

Liquid Vapor

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An experimental and computational investigation of a thin piezofan cooler

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992547 ◽

2017 ◽

Author(s):

M. Baris Dogruoz ◽

Mehmet Arik ◽

Shadi Parsa

Keyword(s):

Computational Investigation

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Experiments on the simultaneous two-phase liquid cooling of multiple simulated servers at differing vertical rack positions in steady state

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992577 ◽

2017 ◽

Author(s):

Felipe Valenzuela ◽

Alfonso Ortega ◽

Gerard Jones ◽

Amy Fleischer ◽

Steven Schon ◽

...

Keyword(s):

Steady State ◽

Liquid Cooling ◽

Two Phase ◽

Phase Liquid

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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

[Back cover]

An area-scalable two-layer evaporator wick concept for high-heat-flux vapor chambers

Thermal analysis of white light-emitting diodes structures with hybrid quantum dots/phosphor layer

Effect of subcooling, flow rate and surface characteristics on flow boiling performance of high performance liquid cooled immersion server model

Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments

Towards using nanoelectrospray for evaporative heat transfer enhancement

Investigation of thermal transport across solid interfaces with randomly distributed nanostructures

Parametric study of liquid-vapor interface within a woven metallic wire mesh screen

An experimental and computational investigation of a thin piezofan cooler

Experiments on the simultaneous two-phase liquid cooling of multiple simulated servers at differing vertical rack positions in steady state

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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

[Back cover]

An area-scalable two-layer evaporator wick concept for high-heat-flux vapor chambers

Thermal analysis of white light-emitting diodes structures with hybrid quantum dots/phosphor layer

Effect of subcooling, flow rate and surface characteristics on flow boiling performance of high performance liquid cooled immersion server model

Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments

Towards using nanoelectrospray for evaporative heat transfer enhancement

Investigation of thermal transport across solid interfaces with randomly distributed nanostructures

Parametric study of liquid-vapor interface within a woven metallic wire mesh screen

An experimental and computational investigation of a thin piezofan cooler

Experiments on the simultaneous two-phase liquid cooling of multiple simulated servers at differing vertical rack positions in steady state

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications