Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A Fine Pitch And High Aspect Ratio Bump Array For Flip-chip Interconnection

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639906 ◽

2005 ◽

Cited By ~ 4

Author(s):

H. Yamada ◽

Y. Konooh ◽

M. Saito

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Flip Chip ◽

Fine Pitch

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Module Frequency And Noise Budget Limitations/tradeoffs In Multi-chip Modules As A Function Of CMOS Chips Integration

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639918 ◽

2005 ◽

Cited By ~ 1

Author(s):

R. Senthinathan ◽

J.L. Prince ◽

A.C. Cangellaris

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Expert System For Manufacturing

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639871 ◽

2005 ◽

Author(s):

T. Leong ◽

Lee Ling Ling ◽

Ching Kah Hiang ◽

Yap Chun Ming ◽

K. SeeIan ◽

...

Keyword(s):

Expert System

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Machine Vision In Robotic Guidance For Pga Burn-in Board Loading

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639864 ◽

2005 ◽

Author(s):

Eng Chin Peng

Keyword(s):

Machine Vision

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Screening ICs On The Bare Chip Level: Temporary Packaging

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639895 ◽

2005 ◽

Author(s):

D. Chu ◽

C.A. Reber ◽

D.W. Palmer

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Military Multichip Module Packaging Design And Manufacture

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639893 ◽

2005 ◽

Cited By ~ 1

Author(s):

C. Cleveland ◽

D. Pietila ◽

M. Rassaian ◽

T. White

Keyword(s):

Multichip Module ◽

Packaging Design ◽

Design And Manufacture

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Automated 3D X-ray Inspection Of Fine Pitch PCB's

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639888 ◽

2005 ◽

Cited By ~ 7

Author(s):

R.F. Hanke ◽

T. Weiss ◽

N. Petsch

Keyword(s):

X Ray ◽

Fine Pitch

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Energy Systems Product Delivery Project

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639900 ◽

2005 ◽

Author(s):

S. Long ◽

M.A. Kowalski

Keyword(s):

Energy Systems ◽

Product Delivery

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Molding Of Plastic Components Using Micro-EDM Tools

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639879 ◽

2005 ◽

Author(s):

Hong Li ◽

S.D. Senturia

Keyword(s):

Micro Edm ◽

Plastic Components

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High Density Multilayer Substrate For Si On Si High Speed Module

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1992.639919 ◽

2005 ◽

Cited By ~ 4

Author(s):

M. Kimura ◽

T. Shimoto ◽

K. Matsui ◽

K. Utsumi ◽

T. Kusaka ◽

...

Keyword(s):

High Speed ◽

High Density ◽

Multilayer Substrate

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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A Fine Pitch And High Aspect Ratio Bump Array For Flip-chip Interconnection

Module Frequency And Noise Budget Limitations/tradeoffs In Multi-chip Modules As A Function Of CMOS Chips Integration

Expert System For Manufacturing

Machine Vision In Robotic Guidance For Pga Burn-in Board Loading

Screening ICs On The Bare Chip Level: Temporary Packaging

Military Multichip Module Packaging Design And Manufacture

Automated 3D X-ray Inspection Of Fine Pitch PCB's

Energy Systems Product Delivery Project

Molding Of Plastic Components Using Micro-EDM Tools

High Density Multilayer Substrate For Si On Si High Speed Module

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
Latest Publications