2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Latest Publications

TOTAL DOCUMENTS

115

(FIVE YEARS 115)

H-INDEX

2

(FIVE YEARS 2)

Published By IEEE

9780956808660

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951882 ◽

2019 ◽

Author(s):

Sheng-Chi Hsieh ◽

Fu-Chen. Chu ◽

Cheng-Yu Ho ◽

Chen-Chao Wang

Keyword(s):

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Acceleration factors for reliability analysis of electronic assemblies

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951869 ◽

2019 ◽

Author(s):

Enrico Galbiati

Keyword(s):

Reliability Analysis ◽

Electronic Assemblies

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An approach for failure prediction in H3 TRB-tests

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951836 ◽

2019 ◽

Author(s):

Elisabeth Kolbinger ◽

Felix Wuest ◽

Marius van Dijk ◽

Stefan Trampert ◽

Klaus-Dieter Lang

Keyword(s):

Failure Prediction

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Design of Interfacial Chemistry for Inducing Low Temperature Sintering of Silver Micro-fillers within Epoxy-based Binders

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951755 ◽

2019 ◽

Author(s):

Masahiro Inoue ◽

Shiho Nakazawa

Keyword(s):

Low Temperature ◽

Low Temperature Sintering ◽

Interfacial Chemistry ◽

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Packaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951842 ◽

2019 ◽

Author(s):

Stoyan Stoyanov ◽

Chris Bailey ◽

Rhys Waite ◽

Christopher Hicks ◽

Terry Golding

Keyword(s):

Focal Plane ◽

Compound Semiconductor ◽

Focal Plane Arrays ◽

Reliability Performance

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Simulation of temperature profiles in reflow ovens for soldering area array components

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951860 ◽

2019 ◽

Author(s):

A. Yuile ◽

S. Wiese

Keyword(s):

Temperature Profiles ◽

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ALD Coatings to Mitigate Against Tin Whiskers and Upgrade the Environmental Durability of Electronic Circuit Boards

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951757 ◽

2019 ◽

Author(s):

Terho Kutilainen ◽

Marko Pudas ◽

Mark A. Ashworth ◽

Geoffrey D. Wilcox ◽

Jussi Hokka

Keyword(s):

Electronic Circuit ◽

Tin Whiskers ◽

Circuit Boards ◽

Environmental Durability

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A Finite Element Modelling Approach of Test Setups for Multilayer Ceramic Capacitors

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951852 ◽

2019 ◽

Author(s):

Vlad Serea ◽

Steffen Wiese

Keyword(s):

Finite Element ◽

Finite Element Modelling ◽

Multilayer Ceramic Capacitors ◽

Element Modelling ◽

Ceramic Capacitors ◽

Multilayer Ceramic ◽

Modelling Approach

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Ag and Si particles sintering technology for SiC power device

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951857 ◽

2019 ◽

Author(s):

M. Ueshima ◽

M. Haga ◽

Tomoaki Mototsuji ◽

Yusuke Isono

Keyword(s):

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Picosecond Laser Structuring Technology for LTCC - the Improvement of Fine Line Structuring

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951813 ◽

2019 ◽

Author(s):

N. Gutzeit ◽

A. Schulz ◽

M. Fischer ◽

T. Thelemann ◽

J. Muller

Keyword(s):

Picosecond Laser ◽

Fine Line ◽

Laser Structuring

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