Ultra-thin Chip Technology and Applications
Latest Publications

TOTAL DOCUMENTS

34

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By Springer New York

9781441972750, 9781441972767

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Through-Silicon Vias Using Bosch DRIE Process Technology

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_9 ◽

2010 ◽

pp. 81-91 ◽

Cited By ~ 3

Author(s):

Franz Laermer ◽

Andrea Urban

Keyword(s):

Process Technology ◽

Through Silicon Vias ◽

Silicon Vias

Epitaxial Growth and Selective Etching Techniques

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_6 ◽

2010 ◽

pp. 53-60 ◽

Cited By ~ 3

Author(s):

Evangelos A. Angelopoulos ◽

Alexander Kaiser

Keyword(s):

Epitaxial Growth ◽

Selective Etching

Bendable Electronics for Retinal Implants

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_28 ◽

2010 ◽

pp. 363-375

Author(s):

Heinz-Gerd Graf

Keyword(s):

Retinal Implants ◽

Bendable Electronics

Thermal Effects in Thin Silicon Dies: Simulation and Modelling

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_23 ◽

2010 ◽

pp. 287-308 ◽

Cited By ~ 1

Author(s):

Niccolò Rinaldi ◽

Salvatore Russo ◽

Vincenzo d’Alessandro

Keyword(s):

Thermal Effects ◽

Simulation And Modelling ◽

Thin Silicon

Substrate Handling Techniques for Thin Wafer Processing

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_12 ◽

2010 ◽

pp. 125-138 ◽

Cited By ~ 3

Author(s):

Christof Landesberger ◽

Sabine Scherbaum ◽

Karlheinz Bock

Keyword(s):

Wafer Processing

3D-IC Technology Using Ultra-Thin Chips

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_11 ◽

2010 ◽

pp. 109-123

Author(s):

Mitsumasa Koyanagi

Keyword(s):

3D Ic ◽

Ic Technology

Through-Silicon via Technology for RF and Millimetre-Wave Applications

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_34 ◽

2010 ◽

pp. 445-453

Author(s):

Alvin Joseph ◽

Cheun-Wen Huang ◽

Anthony Stamper ◽

Wayne Woods ◽

Dan Vanslette ◽

...

Keyword(s):

Through Silicon Via ◽

Millimetre Wave

RFID Transponders

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_30 ◽

2010 ◽

pp. 389-398 ◽

Cited By ~ 1

Author(s):

Cor Scherjon

Piezojunction Effect: Stress Influence on Bipolar Transistors

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_22 ◽

2010 ◽

pp. 271-285

Author(s):

J. Fredrik Creemer ◽

Patrick J. French

Keyword(s):

Bipolar Transistors ◽

Stress Influence

Ultra-thin Wafer Fabrication Through Dicing-by-Thinning

Ultra-thin Chip Technology and Applications ◽

10.1007/978-1-4419-7276-7_4 ◽

2010 ◽

pp. 33-43 ◽

Cited By ~ 6

Author(s):

Christof Landesberger ◽

Sabine Scherbaum ◽

Karlheinz Bock

Keyword(s):

Wafer Fabrication