3rd Electronics System Integration Technology Conference ESTC
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9781424485536
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Anodic bonding at low voltage using microstructured borosilicate glass thin-films

2010 ◽  
Author(s):  
Juergen Leib ◽  
Ulli Hansen ◽  
Simon Maus ◽  
Holger Feindt ◽  
Karin Hauck ◽  
...  
Keyword(s):  
Thin Films ◽  
Borosilicate Glass ◽  
Low Voltage ◽  
Anodic Bonding

Stacked Anodized Metal Substrate for high thermal dissipation performance

2010 ◽  
Author(s):  
Chang-Hyun Lim ◽  
Young-Ki Lee ◽  
Ki-Ho Seo ◽  
Jong-Woon Kim ◽  
Seog-Moon Choi
Keyword(s):  
Metal Substrate ◽  
Thermal Dissipation

Water diffusion in micro- and nano-particle filled encapsulants

2010 ◽  
Author(s):  
T. Braun ◽  
L. Georgi ◽  
J. Bauer ◽  
M. Koch ◽  
K.-F. Becker ◽  
...  
Keyword(s):  
Water Diffusion ◽  
Nano Particle
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