3rd Electronics System Integration Technology Conference ESTC
Latest Publications

TOTAL DOCUMENTS

222
(FIVE YEARS 0)

H-INDEX

10
(FIVE YEARS 0)

Published By IEEE

9781424485536
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates

2010 ◽  
Author(s):  
C. Landesberger ◽  
E. Yacoub-George ◽  
W. Hell ◽  
K. Bock
Keyword(s):  
Self Assembly

Fundamental analysis of embroidered contacts for electronics in textiles

2010 ◽  
Author(s):  
Torsten Linz ◽  
Erik Simon ◽  
Hans Walter
Keyword(s):  
Fundamental Analysis

Anodic bonding at low voltage using microstructured borosilicate glass thin-films

2010 ◽  
Author(s):  
Juergen Leib ◽  
Ulli Hansen ◽  
Simon Maus ◽  
Holger Feindt ◽  
Karin Hauck ◽  
...  
Keyword(s):  
Thin Films ◽  
Borosilicate Glass ◽  
Low Voltage ◽  
Anodic Bonding

Stacked Anodized Metal Substrate for high thermal dissipation performance

2010 ◽  
Author(s):  
Chang-Hyun Lim ◽  
Young-Ki Lee ◽  
Ki-Ho Seo ◽  
Jong-Woon Kim ◽  
Seog-Moon Choi
Keyword(s):  
Metal Substrate ◽  
Thermal Dissipation

Stretchable electronics manufacturing and application

2010 ◽  
Author(s):  
Thomas Loher ◽  
Manuel Seckel ◽  
Andreas Ostmann
Keyword(s):  
Electronics Manufacturing ◽  
Stretchable Electronics

Modeling and validation of evaluation method on IC chip pick-up performance of dicing/die bonding tape

2010 ◽  
Author(s):  
Naoya Saiki ◽  
Kazuaki Inaba ◽  
Kikuo Kishimoto ◽  
Hideo Seno ◽  
Isao Ichikawa
Keyword(s):  
Evaluation Method ◽  
Die Bonding

Water diffusion in micro- and nano-particle filled encapsulants

2010 ◽  
Author(s):  
T. Braun ◽  
L. Georgi ◽  
J. Bauer ◽  
M. Koch ◽  
K.-F. Becker ◽  
...  
Keyword(s):  
Water Diffusion ◽  
Nano Particle
Load More ...
Sign in / Sign up

Export Citation Format

Share Document