3rd Electronics System Integration Technology Conference ESTC
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222
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Published By IEEE

9781424485536
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Stacked Anodized Metal Substrate for high thermal dissipation performance

2010 ◽  
Author(s):  
Chang-Hyun Lim ◽  
Young-Ki Lee ◽  
Ki-Ho Seo ◽  
Jong-Woon Kim ◽  
Seog-Moon Choi
Keyword(s):  
Metal Substrate ◽  
Thermal Dissipation

Anodic bonding at low voltage using microstructured borosilicate glass thin-films

2010 ◽  
Author(s):  
Juergen Leib ◽  
Ulli Hansen ◽  
Simon Maus ◽  
Holger Feindt ◽  
Karin Hauck ◽  
...  
Keyword(s):  
Thin Films ◽  
Borosilicate Glass ◽  
Low Voltage ◽  
Anodic Bonding

Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging

2010 ◽  
Author(s):  
Nils Hoivik ◽  
Kaiying Wang ◽  
Knut Aasmundtveit ◽  
Guttorm Salomonsen ◽  
Adriana Lapadatu ◽  
...  
Keyword(s):  
Wafer Level

Reliability improvements for advanced Wafer Level packaging

2010 ◽  
Author(s):  
John Hunt ◽  
Danial Huang ◽  
Jessica Chiu ◽  
MaggieMC Liu ◽  
Junior Lin ◽  
...  
Keyword(s):  
Wafer Level ◽  
Wafer Level Packaging
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