Nano-Bio- Electronic, Photonic and MEMS Packaging
Latest Publications

TOTAL DOCUMENTS

25

(FIVE YEARS 25)

H-INDEX

0

(FIVE YEARS 0)

Published By Springer International Publishing

9783030499907, 9783030499914

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Nanoprobes for Live-Cell Gene Detection

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_11 ◽

2021 ◽

pp. 237-251

Author(s):

Gang Bao ◽

Won Jong Rhee ◽

Andrew Tsourkas

Keyword(s):

Live Cell ◽

Gene Detection ◽

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Thermally Conductive Nanocomposites

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_7 ◽

2021 ◽

pp. 115-136

Author(s):

Jan Felba

Keyword(s):

Conductive Nanocomposites ◽

Thermally Conductive

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Some Nanomaterials for Microelectronics and Photonics Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_1 ◽

2021 ◽

pp. 3-13

Author(s):

C. P. (Ching-Ping) Wong ◽

Kyoung-sik Moon

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Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic Applications

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_4 ◽

2021 ◽

pp. 61-79

Author(s):

Andrew Hunt ◽

Yongdong Jiang ◽

Zhiyong Zhao ◽

Ganesh Venugopal

Keyword(s):

Chemical Vapor ◽

Vapor Condensation ◽

Chemical Vapor Condensation

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Biomimetic Lotus Effect Surfaces for Nanopackaging

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_15 ◽

2021 ◽

pp. 349-374

Author(s):

Yonghao Xiu ◽

C. P. (Ching-Ping) Wong

Keyword(s):

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Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_3 ◽

2021 ◽

pp. 31-60

Author(s):

Wei Lin ◽

C. P. (Ching-Ping) Wong

Keyword(s):

Carbon Nanomaterials ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Electrical Interconnects ◽

Interface Materials

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Packaging of Biomolecular and Chemical Microsensors

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_13 ◽

2021 ◽

pp. 289-315

Author(s):

Peter J. Hesketh ◽

Xiaohui Lin

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Fe-Based Anode Materials for Asymmetric Supercapacitors

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_22 ◽

2021 ◽

pp. 493-515

Author(s):

Jizhang Chen ◽

Cuiping Han ◽

C. P. (Ching-Ping) Wong

Keyword(s):

Anode Materials ◽

Asymmetric Supercapacitors

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Nano-conductive Adhesives for Nano-electronics Interconnection

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_2 ◽

2021 ◽

pp. 15-30

Author(s):

Yi Li ◽

Kyoung-sik Moon ◽

C. P. (Ching-Ping) Wong

Keyword(s):

Conductive Adhesives

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Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics

Nano-Bio- Electronic, Photonic and MEMS Packaging ◽

10.1007/978-3-030-49991-4_16 ◽

2021 ◽

pp. 377-403

Author(s):

Herbert Robert ◽

Woon-Hong Yeo

Keyword(s):

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