Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
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Achieving accurate thermal characterization using a CFD code: a case study of PLCC packages

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512052 ◽

2002 ◽

Author(s):

J. Burgos ◽

V.P. Manno ◽

K. Azar

Keyword(s):

Thermal Characterization

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Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512057 ◽

2002 ◽

Author(s):

P. Dondon ◽

E. Woirgard ◽

C. Zardini

Keyword(s):

Infrared Thermography ◽

Thermal Transient ◽

Electronic Assemblies

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High performance air cooling scheme using ducted microchannel parallel plate-fin heat sinks

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512061 ◽

2002 ◽

Author(s):

M.B. Kleiner ◽

S.A. Kuehn ◽

K. Haberger

Keyword(s):

Parallel Plate ◽

High Performance ◽

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Optimum design and selection of heat sinks

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512051 ◽

2002 ◽

Author(s):

S. Lee

Keyword(s):

Optimum Design ◽

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A novel approach for the thermal characterization of electronic parts

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512044 ◽

2002 ◽

Author(s):

C. Lasance ◽

H. Vinke ◽

H. Rosten ◽

K.-L. Weiner

Keyword(s):

Thermal Characterization ◽

Novel Approach ◽

Electronic Parts

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An assessment of the thermal performance of the PBGA family

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512046 ◽

2002 ◽

Author(s):

S. Mulgaonker ◽

B. Chambers ◽

M. Mahalingam

Keyword(s):

Thermal Performance

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The evolution of IBM high performance cooling technology

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512059 ◽

2002 ◽

Author(s):

R.E. Simons

Keyword(s):

High Performance ◽

Cooling Technology

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Enhancement of convection cooling of integrated circuit components

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512047 ◽

2002 ◽

Author(s):

C. Herman ◽

B. Puranik ◽

E. Kang ◽

S. Szokolai

Keyword(s):

Integrated Circuit ◽

Convection Cooling ◽

Circuit Components

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Effect on observed package thermal performance of system board metal content

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512048 ◽

2002 ◽

Author(s):

D. Billings ◽

R.P. Stout

Keyword(s):

Thermal Performance ◽

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Asymptotic thermal analysis of electronic packages and printed-circuit board

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1995.512062 ◽

2002 ◽

Author(s):

Da-Guang Liu ◽

V. Phanilatha ◽

Qi-Jun Zhang ◽

M.N. Nakhla

Keyword(s):

Thermal Analysis ◽

Printed Circuit Board ◽

Circuit Board ◽

Electronic Packages ◽

Printed Circuit

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