2021 International Conference on Electronics Packaging (ICEP)
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The control of material surface condition for plasma technology to fabricate advanced packaging

2021 ◽  
Author(s):  
Daisuke Hironiwa ◽  
Yasuhiro Morikawa ◽  
Tsuyoshi Kagami ◽  
Takashi Kurimoto ◽  
Kazumasa Horita ◽  
...  
Keyword(s):  
Surface Condition ◽  
Material Surface ◽  
Plasma Technology ◽  
Advanced Packaging

Pressureless and low temperature direct bonding on Si, SiC and GaN via Ag paste sinter-joining

2021 ◽  
Author(s):  
Zheng Zhang ◽  
Chuantong Chen ◽  
Aiji Suetake ◽  
Ming-Chun Hsieh ◽  
Aya Iwaki ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Paste ◽  
Sinter Joining

Photonic Sintering of Composite Pastes with Copper Oxide Powders Using Different Light Sources

2021 ◽  
Author(s):  
Wei-Han Cheng ◽  
Po-Hsiang Chiu ◽  
Yan-Jie Li ◽  
Ming-Tsang Lee ◽  
Kiyokazu Yasuda ◽  
...  
Keyword(s):  
Copper Oxide ◽  
Light Sources ◽  
Oxide Powders ◽  
Photonic Sintering

A Technique to Mount Narrow-Pitch Micro Solder Balls

2021 ◽  
Author(s):  
Shunichi HARAGUCHI ◽  
Chisato OYAMA ◽  
Kotaro USUDA ◽  
Hideki IKEDA
Keyword(s):  
Solder Balls
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