2021 International Conference on Electronics Packaging (ICEP)
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Effect of sintering density on thermal reliability by non-pressure sintering die-attach

2021 ◽  
Author(s):  
Ryo Kato ◽  
Masatoshi Okuda ◽  
Suguru Hashidate ◽  
Takamichi Mori ◽  
Junichiro Minami ◽  
...  
Keyword(s):  
Thermal Reliability ◽  
Die Attach

Silver-Seed Cu-Wirings for High-Speed Transmission

2021 ◽  
Author(s):  
Norimasa Fukazaw ◽  
Wataru Fujikawa ◽  
Akinori Furutani ◽  
Shota Niibayashi ◽  
Hiroyuki Hagiwara ◽  
...  
Keyword(s):  
High Speed

Investigation of Heat Transfer in 3D Packaging for Practical-Scale Quantum Annealing Machines

2021 ◽  
Author(s):  
Wei Feng ◽  
Katsuya Kikuchi ◽  
Mutsuo Hidaka ◽  
Hirotake Yamamori ◽  
Yuuki Araga ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Quantum Annealing ◽  
3D Packaging

Voidless Chip-on-Wafer Process for Functional Interposer

2021 ◽  
Author(s):  
Y. Satake ◽  
T. Funaki ◽  
K. Kobinata ◽  
Y. S. Kim ◽  
T. Ohba
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