Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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Published By Springer Berlin Heidelberg

9783662488218, 9783662488232

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Tensile-Compress Fatigue Behavior of Solder Joints

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_3 ◽

2015 ◽

pp. 67-89

Author(s):

Qingke Zhang

Keyword(s):

Solder Joints ◽

Fatigue Behavior

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Fracture Behavior of IMCs at Cu/Pb-Free Solder Interface

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_2 ◽

2015 ◽

pp. 35-66

Author(s):

Qingke Zhang

Keyword(s):

Fracture Behavior ◽

Free Solder ◽

Solder Interface

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Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_5 ◽

2015 ◽

pp. 119-140

Author(s):

Qingke Zhang

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Fatigue Behavior ◽

Thermal Fatigue Behavior

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Research Progress in Pb-Free Soldering

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_1 ◽

2015 ◽

pp. 1-33

Author(s):

Qingke Zhang

Keyword(s):

Research Progress

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Conclusions

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_6 ◽

2015 ◽

pp. 141-143

Author(s):

Qingke Zhang

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Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_4 ◽

2015 ◽

pp. 91-118

Author(s):

Qingke Zhang

Keyword(s):

Solder Joints ◽

Fatigue Behavior ◽

Shear Creep ◽

Creep Fatigue ◽

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