A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

2015 ◽  
Author(s):  
Hirokazu Oriyama ◽  
Takashi Kawakami ◽  
Takahiro Kinoshita
Keyword(s):  
Solder Joint ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Mechanical Design ◽  
Low Cycle Fatigue ◽  
Creep Damage ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder

Sn-Ag-Cu solder materials have been widely used for the mount process of electronics devices or semiconductor packages on print circuit board (PCB). The solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomenon. The fatigue life of solder joint has been investigated by many researchers with experimental and numerical methods. Generally, the induced thermal stress in solder joints should be relaxed as soon and creep damage is considered to be ignored in order to estimate lives of joints. However, it is probable that long term stress is applied to solder joints by the elastic follow-up phenomenon which are depending on the stiffness ratio between solder joints and the electronics device, because the elastic strain in PCB or the electronics device shifts to creep strain in solder joints gradually during a long time. Then the creep damage of solder joint should be counted for the mechanical design of mounted PCBs. And it is known that the interaction between creep damage and fatigue damage significantly shorten the life. In this study, it was discussed whether the interaction between fatigue damage and creep damage has to be considered or not for the mechanical design of the lead free solder joint with basic creep-fatigue tests at an elevated temperature.

scholarly journals Creep-Fatigue Behavior of Microelectronic Solder Joints

1991 ◽  
Vol 225 ◽  
Author(s):  
R. G. Ross ◽  
L. C. Wen ◽  
G. R. Mon ◽  
E. Jetter ◽  
J. Winslow
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Thermal Environment ◽  
Fatigue Behavior ◽  
Time To Failure ◽  
Test Fixture ◽  
Failure Data ◽  
Analytical Results ◽  
Creep Fatigue ◽  
Alloy Properties

ABSTRACTEven at room temperature, solder joints exhibit both creep and fatigue behavior that is strongly dependent on solder joint configuration, the thermal environment, and the solder alloy properties. The microstructures of solder joints with up to 25 years of aging have been studied using SEM/EDS and metallographic techniques. Data are presented on grain growth and metallurgical composition versus aging time. A special non-linear finite element creep-fatigue simulation model has been developed, based on measured strain-rate hardness relationships, and used to analytically predict the effects of observed metallurgical changes and the effects of lead stiffness in solder joint creepfatigue interaction. To corroborate the analytical results, a special bi-metallic test fixture has been developed to accelerate the thermo-mechanical loading of solder joints in thermal cycling environments. Measured time-to-failure data for various electronicpackage lead configurations/stiffnesses, including gullwing and J-lead, are presented and shown to be in reasonable agreement with the analytical results.

Determination of Anand Parameters From Shear Creep Tests of Lead Free Solder Joints

2021 ◽  
Author(s):  
Mohammad Ashraful Haq ◽  
Mohd Aminul Hoque ◽  
Jeffrey Suhling ◽  
Pradeep Lall
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Tests ◽  
Shear Creep ◽  
Free Solder

scholarly journals Creep-Fatigue Behavior of Microelectronic Solder Joints

1991 ◽  
Vol 226 ◽  
Author(s):  
R.G. Ross ◽  
L.C. Wen ◽  
G.R. Mon ◽  
E. Jetter ◽  
J. Winslow
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Thermal Environment ◽  
Fatigue Behavior ◽  
Time To Failure ◽  
Test Fixture ◽  
Failure Data ◽  
Analytical Results ◽  
Creep Fatigue ◽  
Alloy Properties

AbstractEven at room temperature, solder joints exhibit both creep and fatigue behavior that is strongly dependent on solder joint configuration, the thermal environment, and the solder alloy properties. The microstructures of solder joints with up to 25 years of aging have been studied using SEM/EDS and metallographic techniques. Data are presented on grain growth and metallurgical composition versus aging time. A special non-linear finite element creep-fatigue simulation model has been developed, based on measured strain-rate hardness relationships, and used to analytically predict the effects of observed metallurgical changes and the effects of lead stiffness in solder joint creepfatigue interaction. To corroborate the analytical results, a special bi-metallic test fixture has been developed to accelerate the thermo-mechanical loading of solder joints in thermal cycling environments. Measured time-to-failure data for various electronicpackage lead configurations/stiffnesses, including gullwing and J-lead, are presented and shown to be in reasonable agreement with the analytical results.

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

2005 ◽  
Vol 297-300 ◽  
pp. 831-836 ◽  
Author(s):  
Il Ho Kim ◽  
Tae Sang Park ◽  
Se Young Yang ◽  
Soon Bok Lee
Keyword(s):  
Solder Joints ◽  
Large Strain ◽  
Fatigue Behavior ◽  
Fatigue Property ◽  
Element Model ◽  
Lead Free ◽  
Strain Effect ◽  
Lead Free Solder ◽  
Power Cycling ◽  
Free Solder

Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

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