Tensile-Compress Fatigue Behavior of Solder Joints

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_3 ◽

2015 ◽

pp. 67-89

Author(s):

Qingke Zhang

Keyword(s):

Solder Joints ◽

Fatigue Behavior

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Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757419 ◽

2019 ◽

Author(s):

Sinan Su ◽

Minghong Jian ◽

Xin Wei ◽

Francy John Akkara ◽

Sa'd Hamasha ◽

...

Keyword(s):

Surface Finish ◽

Solder Joints ◽

Fatigue Behavior ◽

Effect Of Surface

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Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

Journal of Electronic Materials ◽

10.1007/s11664-017-5980-0 ◽

2017 ◽

Vol 47 (3) ◽

pp. 1881-1895 ◽

Author(s):

Yong Zuo ◽

Thomas R. Bieler ◽

Quan Zhou ◽

Limin Ma ◽

Fu Guo

Keyword(s):

Solder Joints ◽

Fatigue Behavior ◽

Thermomechanical Fatigue

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Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_15 ◽

2007 ◽

pp. 237-246 ◽

Author(s):

K. N. Subramanian

Keyword(s):

Solder Joints ◽

Fatigue Behavior ◽

Thermomechanical Fatigue ◽

Factors Influencing ◽

Service Environments

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Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.909619 ◽

2001 ◽

Vol 24 (1) ◽

pp. 10-16 ◽

Author(s):

S.H. Fan ◽

Y.C. Chan ◽

C.W. Tang ◽

J.K.L. Lai

Keyword(s):

Cooling Rate ◽

Solder Joints ◽

Fatigue Behavior ◽

Isothermal Fatigue

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Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints

Springer Theses - Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ◽

10.1007/978-3-662-48823-2_5 ◽

2015 ◽

pp. 119-140

Author(s):

Qingke Zhang

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Fatigue Behavior ◽

Thermal Fatigue Behavior

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Research on Low Cycle Fatigue Behavior of BGA Structure Lead-free Solder Joints

Journal of Mechanical Engineering ◽

10.3901/jme.2014.20.054 ◽

2014 ◽

Vol 50 (20) ◽

pp. 54

Author(s):

Hongbo QIN

Keyword(s):

Solder Joints ◽

Low Cycle Fatigue ◽

Fatigue Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Cycle Fatigue ◽

Structure Lead ◽

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Thermal fatigue behavior of J-lead solder joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.465160 ◽

1995 ◽

Vol 18 (3) ◽

pp. 611-617 ◽

Author(s):

C.G. Schmidt ◽

J.W. Simons ◽

C.H. Kanazawa ◽

D.C. Erlich

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Fatigue Behavior ◽

Thermal Fatigue Behavior

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Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Microelectronics Reliability ◽

10.1016/j.microrel.2015.10.021 ◽

2016 ◽

Vol 56 ◽

pp. 136-147 ◽

Author(s):

Muhannad Mustafa ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Experimental Determination ◽

Isothermal Aging ◽

Solder Joints ◽

Fatigue Behavior ◽

Lead Free ◽

Microelectronic Packaging ◽

Lead Free Solder ◽

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A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430630 ◽

2006 ◽

Author(s):

Ilho Kim ◽

Soon-Bok Lee

Keyword(s):

Comparative Study ◽

Solder Joints ◽

Fatigue Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Mechanical Fatigue ◽

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Estimation of the thermal-mechanical fatigue behavior of Sn/Pb solder joints

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866201 ◽

2002 ◽

Author(s):

Xi-Shu Wang ◽

Shou-Wen Yu ◽

N. Kawagoishi

Keyword(s):

Solder Joints ◽

Fatigue Behavior ◽

Thermal Mechanical Fatigue ◽

Mechanical Fatigue

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