2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

188

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9781538676684

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654313 ◽

2018 ◽

Author(s):

Kelvin P. L. Pun ◽

Jason Rotanson ◽

Navdeep S. Dhaka ◽

Chee-Wah Cheung ◽

Alan H. S. Chan

Keyword(s):

Free Surface ◽

Solid State ◽

Diffusion Bonding ◽

Surface Finishing ◽

Solid State Diffusion ◽

State Diffusion ◽

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Modeling and simulation of chemical amplification photoresist to produce high-density cone-shaped micro bumps

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654401 ◽

2018 ◽

Author(s):

Daiki Kumagwa ◽

Mamoru Sakamoto ◽

Yohei Aoki ◽

Tanemasa Asano

Keyword(s):

Modeling And Simulation ◽

High Density ◽

Chemical Amplification

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Low-temperature Cu-Cu bonding by self-reduction of particle-free Ag ion paste

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654288 ◽

2018 ◽

Author(s):

Junjie Li ◽

Tielin Shi ◽

Guanglan Liao ◽

Zirong Tang

Keyword(s):

Low Temperature ◽

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Wideband slot array antenna for 1 THz band imaging device

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654353 ◽

2018 ◽

Author(s):

Kota Tsugami ◽

Tanemasa Asano ◽

Haruichi Kanaya

Keyword(s):

Array Antenna ◽

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Research on Feedforward Control in the linear motor direct drive XY two-dimensional platform

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654323 ◽

2018 ◽

Author(s):

He Yunbo ◽

HE ZuoXiong ◽

Gao Jian ◽

Cui Chengqiang ◽

Yang Zhijun ◽

...

Keyword(s):

Feedforward Control ◽

Linear Motor ◽

Two Dimensional ◽

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Hybrid Cu-SiN and Cu-SiOx Direct Bonding of 200 MM CMOS Wafers with Five Metal Levels: Morphological, Electrical and Reliability Characterization

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654300 ◽

2018 ◽

Author(s):

Celso Cavaco ◽

Konstantinos Chatzinis ◽

Bert van Lijnschoten ◽

Stefano Guerrieri

Keyword(s):

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Fabrication and Characterization of Surface Electrode Ion Trap for Quantum Computing

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654328 ◽

2018 ◽

Author(s):

Jing Tao ◽

Nam Piau Chew ◽

Luca Guidoni ◽

Yu Dian Lim ◽

Peng Zhao ◽

...

Keyword(s):

Quantum Computing ◽

Ion Trap ◽

Surface Electrode ◽

Fabrication And Characterization

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Critical Factors Impacting bonding strength of UBM in Bumps and Methodologies for Optimization

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654383 ◽

2018 ◽

Author(s):

Anandan Ramasamy ◽

Inderjit Singh ◽

Shin Low ◽

Bryant Lin

Keyword(s):

Bonding Strength ◽

Critical Factors

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Evaluation of Piezoresistive Polymer-based Traces for Non-invasive Sensor Patch

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654338 ◽

2018 ◽

Author(s):

Ramona B. Damalerio ◽

Ruiqi Lim ◽

Weiguo Chen ◽

David Sze Wai Choong ◽

Ming-Yuan Cheng

Keyword(s):

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A Novel Double-layered Heat Sink for High Power Electronics

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2018.8654443 ◽

2018 ◽

Author(s):

Yicang Huang ◽

Mingliang Xu ◽

Hui Li ◽

Shengnan Shen ◽

Shiyue Ma

Keyword(s):

Power Electronics ◽

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