2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

172

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H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538617793

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

LDMOST gate oxide breakdown prediction under realistic RF power application conditions

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060122 ◽

2017 ◽

Cited By ~ 2

Author(s):

Guoqiao Tao ◽

Sjoerd van Nederveen ◽

Mario de Vaan

Keyword(s):

Gate Oxide ◽

Rf Power ◽

Oxide Breakdown ◽

Power Application

[Title page]

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060055 ◽

2017 ◽

Keyword(s):

Title Page

High temperature nanoprobing application for SRAM soft failure fault isolation

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060082 ◽

2017 ◽

Author(s):

F. Rivai ◽

C. Q. Chen ◽

P. T. Ng ◽

P. K. Tan ◽

H. Tan ◽

...

Keyword(s):

High Temperature ◽

Fault Isolation ◽

Soft Failure

Influences of sandwiched structure trench and temperature on the latch-up reliability of LIGBT on thick SOI substrate

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060102 ◽

2017 ◽

Cited By ~ 1

Author(s):

Chunwei Zhang ◽

Yang Li ◽

Xiaoqian Fu ◽

Zhiming Li

Keyword(s):

Sandwiched Structure ◽

Latch Up

Multiscale modeling of defect-related phenomena in high-k based logic and memory devices

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060063 ◽

2017 ◽

Cited By ~ 9

Author(s):

Andrea Padovani ◽

Luca Larcher ◽

Francesco Maria Puglisi ◽

Paolo Pavan

Keyword(s):

Multiscale Modeling ◽

Memory Devices ◽

High K

A standardized methodology for Al-Cu wire bonded intermetallic compound measurement

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060107 ◽

2017 ◽

Author(s):

Ying Sian Chen ◽

Nicolas Liu ◽

Kevin Liu

Keyword(s):

Intermetallic Compound

Dynamic current monitoring and probe laser simulation strategy to analyse complicated functional failure on mixed signal integrated circuit

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060073 ◽

2017 ◽

Author(s):

Gaojie Wen ◽

Xiaocui Li ◽

Li Tian ◽

Jun Ren

Keyword(s):

Integrated Circuit ◽

Probe Laser ◽

Mixed Signal ◽

Functional Failure ◽

Laser Simulation ◽

Simulation Strategy ◽

Current Monitoring

Analytical model for the I-V characteristics of fresh and degraded commercial LEDs

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060173 ◽

2017 ◽

Author(s):

G. Mura ◽

E. Miranda

Keyword(s):

Analytical Model

Failure mode-key factor of a failure analysis' success

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060118 ◽

2017 ◽

Author(s):

Xin Gong

Keyword(s):

Failure Analysis ◽

Failure Mode ◽

Key Factor

A new etchant and its application in wafer level package sample preparation

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2017.8060089 ◽

2017 ◽

Author(s):

Wenxiao Liu ◽

Haibo Dai ◽

J H Lee ◽

Qihua Zhang ◽

Kary Chen

Keyword(s):

Sample Preparation ◽

Wafer Level ◽

Wafer Level Package

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

LDMOST gate oxide breakdown prediction under realistic RF power application conditions

[Title page]

High temperature nanoprobing application for SRAM soft failure fault isolation

Influences of sandwiched structure trench and temperature on the latch-up reliability of LIGBT on thick SOI substrate

Multiscale modeling of defect-related phenomena in high-k based logic and memory devices

A standardized methodology for Al-Cu wire bonded intermetallic compound measurement

Dynamic current monitoring and probe laser simulation strategy to analyse complicated functional failure on mixed signal integrated circuit

Analytical model for the I-V characteristics of fresh and degraded commercial LEDs

Failure mode-key factor of a failure analysis' success

A new etchant and its application in wafer level package sample preparation

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications