2017 18th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9781538629727

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The effect of Sb content in InAs1−xSbx/GaSb type-II superlattices

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046611 ◽

2017 ◽

Author(s):

Dandan Yi ◽

Ming Li ◽

Liancheng Zhao ◽

Chaoying Xie ◽

Liming Gao

Keyword(s):

Type Ii ◽

Type Ii Superlattices

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Impact of tensile strength on thermal fatigue properties and failure modes of Sn-Ag-Cu-Ni solder joints

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046608 ◽

2017 ◽

Author(s):

Xiaodong Liu ◽

Jing Shang ◽

Jianxia Hao ◽

Anmin Hu ◽

Liming Gao ◽

...

Keyword(s):

Tensile Strength ◽

Thermal Fatigue ◽

Failure Modes ◽

Solder Joints ◽

Fatigue Properties

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QFN cutting temperature measurement basing on the infrared thermal imager

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046628 ◽

2017 ◽

Author(s):

Yue Yuan ◽

Huiping Yu ◽

Fei Qin ◽

Liu Yang ◽

Tong An ◽

...

Keyword(s):

Temperature Measurement ◽

Cutting Temperature ◽

Thermal Imager ◽

Infrared Thermal Imager

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Design of a Ku band 7-bit PIN diode phase shifter

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046564 ◽

2017 ◽

Author(s):

Wanfei Lan ◽

Dan Zhong ◽

Dalin Jin ◽

Dan Yang ◽

Zhaojun Zhu ◽

...

Keyword(s):

Phase Shifter ◽

Pin Diode ◽

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Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046715 ◽

2017 ◽

Author(s):

Ning Zhao ◽

Mingyao Wang ◽

Yi Zhong ◽

Haitao Ma ◽

Yunpeng Wang ◽

...

Keyword(s):

Temperature Gradient ◽

Solder Joints ◽

Interfacial Reactions

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Feasibility analysis of the stacked-die ceramic packaging process in automotive electronics

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046476 ◽

2017 ◽

Author(s):

Chongchong Mao ◽

Yuan Zhu ◽

Lianghai Li

Keyword(s):

Feasibility Analysis ◽

Automotive Electronics ◽

Packaging Process

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Atomistic simulation on mechanical behaviors of Al/SiC nanocomposites

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046471 ◽

2017 ◽

Author(s):

Yuping Yan ◽

Shangru Zhou ◽

Sheng Liu

Keyword(s):

Atomistic Simulation ◽

Mechanical Behaviors

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Study on the process of fluid Jet dispensing based on high and low voltage drive

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046451 ◽

2017 ◽

Author(s):

Xikang Cheng ◽

Guiling Deng ◽

Can Zhou ◽

Na Wang ◽

Wenjian Cui

Keyword(s):

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SiC wafer bonding using surface activation method for power device

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046538 ◽

2017 ◽

Author(s):

Fengwen Mu ◽

Masahisa Fujino ◽

Tadatomo Suga ◽

Kenichi Iguchi ◽

Haruo Nakazawa ◽

...

Keyword(s):

Wafer Bonding ◽

Activation Method ◽

Power Device ◽

Surface Activation ◽

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Hermeticity test of low-melting point sealing glass and analysis of encapsulation failure

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046577 ◽

2017 ◽

Author(s):

Rui Tian ◽

Yi Li ◽

Luqiao Yin ◽

Jianhua Zhang

Keyword(s):

Melting Point ◽

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