2017 18th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

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Published By IEEE

9781538629727

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal analysis and characterization of electronic packages with alternative lid coatings

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046468 ◽

2017 ◽

Author(s):

Hengyun Zhang ◽

Shen Xu ◽

Hao Chen ◽

Tingyu Lin

Keyword(s):

Thermal Analysis ◽

Electronic Packages

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Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C-SVM

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046589 ◽

2017 ◽

Cited By ~ 1

Author(s):

Rui Wang ◽

Long Zhili ◽

Zhou Xing

Keyword(s):

Aluminum Wire ◽

Image Morphology

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Influence of solder cap thickness on the interfacial reaction in Cu/Sn/Ni copper pillar bump

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046534 ◽

2017 ◽

Author(s):

Ya Li ◽

Li Rao ◽

Huiqin Ling ◽

Anmin Hu ◽

Ming Li

Keyword(s):

Interfacial Reaction

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A coupled thermal and mechanical modeling to investigate the stress of TSVs considering insulation layer

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046597 ◽

2017 ◽

Author(s):

Hanjie Yang ◽

Sen Cao ◽

Zhuo Chen ◽

Wenhui Zhu

Keyword(s):

Mechanical Modeling ◽

Insulation Layer

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An analysis case on the failure of BGA solder joints

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046553 ◽

2017 ◽

Author(s):

Weiming Li ◽

Xiaowei Sun

Keyword(s):

Solder Joints

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Study on the process of fluid Jet dispensing based on high and low voltage drive

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046451 ◽

2017 ◽

Author(s):

Xikang Cheng ◽

Guiling Deng ◽

Can Zhou ◽

Na Wang ◽

Wenjian Cui

Keyword(s):

Low Voltage

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SiC wafer bonding using surface activation method for power device

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046538 ◽

2017 ◽

Author(s):

Fengwen Mu ◽

Masahisa Fujino ◽

Tadatomo Suga ◽

Kenichi Iguchi ◽

Haruo Nakazawa ◽

...

Keyword(s):

Wafer Bonding ◽

Activation Method ◽

Power Device ◽

Surface Activation ◽

Sic Wafer

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Hermeticity test of low-melting point sealing glass and analysis of encapsulation failure

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046577 ◽

2017 ◽

Cited By ~ 1

Author(s):

Rui Tian ◽

Yi Li ◽

Luqiao Yin ◽

Jianhua Zhang

Keyword(s):

Melting Point ◽

Sealing Glass

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Integrated process for high aspect ratio through glass vias

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046709 ◽

2017 ◽

Cited By ~ 1

Author(s):

Xue Kai ◽

Jiang Feng ◽

Wu Heng ◽

Xiufeng Zhou ◽

Xuefei Ming

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Integrated Process

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Thermo-fluid simulation of the advanced IGBT module in a power stack

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046483 ◽

2017 ◽

Author(s):

Xin-Yu Sun ◽

Sichao Ma ◽

Ming Li ◽

Liming Gao

Keyword(s):

Fluid Simulation ◽

Igbt Module

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2017 18th International Conference on Electronic Packaging Technology (ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal analysis and characterization of electronic packages with alternative lid coatings

Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C-SVM

Influence of solder cap thickness on the interfacial reaction in Cu/Sn/Ni copper pillar bump

A coupled thermal and mechanical modeling to investigate the stress of TSVs considering insulation layer

An analysis case on the failure of BGA solder joints

Study on the process of fluid Jet dispensing based on high and low voltage drive

SiC wafer bonding using surface activation method for power device

Hermeticity test of low-melting point sealing glass and analysis of encapsulation failure

Integrated process for high aspect ratio through glass vias

Thermo-fluid simulation of the advanced IGBT module in a power stack

2017 18th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications