igbt module
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Analytical modeling of thermo-mechanical stress for bond wire of IGBT module

2021 ◽  
Vol 127 ◽  
pp. 114401
Author(s):  
Xingyu Dai ◽  
Xin Yang ◽  
Xinlong Wu ◽  
Chunming Tu ◽  
Guoyou Liu
Keyword(s):  
Mechanical Stress ◽  
Analytical Modeling ◽  
Igbt Module ◽  
Bond Wire

A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation

2021 ◽  
Vol 127 ◽  
pp. 114384
Author(s):  
Xinlong Wu ◽  
Xin Yang ◽  
Xingyu Dai ◽  
Chunming Tu ◽  
Guoyou Liu
Keyword(s):  
Lifetime Prediction ◽  
Igbt Module ◽  
Solder Layer

Thermal Analysis of IGBT Module of Motor Controller

2021 ◽  
Author(s):  
Zhao Weijian ◽  
Cao Jing ◽  
Jing Jun
Keyword(s):  
Thermal Analysis ◽  
Motor Controller ◽  
Igbt Module

Research on Quasi-on-line Extraction Method of Junction-case Thermal Resistance of IGBT Module

2021 ◽  
Author(s):  
Biao Xiao ◽  
Chunming Tu ◽  
Liu Long ◽  
Fei Jiang ◽  
Haoliang Xu ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Extraction Method ◽  
Line Extraction ◽  
Igbt Module ◽  
On Line

A New Design Method of IGBT Module with Embedded Vapor Chamber for Optimal Heat Radiation

2021 ◽  
Author(s):  
Chen Zhang ◽  
Jun Shen ◽  
Xiuchen Xiao ◽  
Qingli Deng ◽  
Huimin Wang ◽  
...  
Keyword(s):  
Design Method ◽  
Heat Radiation ◽  
Vapor Chamber ◽  
Optimal Heat ◽  
Igbt Module

Improve inductive contact failure loss of IGBT module test

2021 ◽  
Author(s):  
Keita Gunji
Keyword(s):  
Module Test ◽  
Igbt Module ◽  
Contact Failure

Impact of thermal interface material on power cycling lifetime of IGBT module

2021 ◽  
pp. 114272
Author(s):  
Jinhao Cai ◽  
Lijian Ding ◽  
Jianing Wang ◽  
Nan Jiang
Keyword(s):  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Cycling ◽  
Igbt Module

Research on Reliability of Solder Layer in IGBT Module Packaging

2021 ◽  
Author(s):  
Panwang Chi ◽  
Shengru Lin ◽  
Yesu Li ◽  
Yiping Liu ◽  
Jicun Lu ◽  
...  
Keyword(s):  
Igbt Module ◽  
Solder Layer

Evaluation of Fatigue Crack Growth in Solder Layer of IGBT Module under Power Cycle by Using J-integral Method

2021 ◽  
Author(s):  
Kai Yang ◽  
Longzao Zhou ◽  
Fengshun Wu ◽  
Yi Zhang ◽  
Yang Han ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Integral Method ◽  
J Integral ◽  
Power Cycle ◽  
Igbt Module ◽  
Solder Layer

Study on Thermal cycle and Insulation Characteristics of High Reliable IGBT Module

2021 ◽  
Author(s):  
Tao Chen ◽  
Minghua Zhang ◽  
Binbin Zhang ◽  
Qing Chen ◽  
Kun Tian ◽  
...  
Keyword(s):  
Thermal Cycle ◽  
Igbt Module
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