2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
Latest Publications

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9781538661994

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A novel metering component for volume management in flow-based microfluidic biochips

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394191 ◽

2018 ◽

Author(s):

Alexander Schneider ◽

Paul Pop ◽

Jan Madsen

Keyword(s):

Volume Management ◽

Microfluidic Biochips

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Synergistic photoluminescent interaction of Si and CdTe quantum dots

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394205 ◽

2018 ◽

Cited By ~ 1

Author(s):

J. A. Garcia-Monge ◽

C. Vazquez-Colon ◽

A. A. Ayon ◽

G. Guisbiers

Keyword(s):

Quantum Dots ◽

Cdte Quantum Dots

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Non-linear FEM simulation of the elasto-plastic behaviour in MEMS specimens

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394185 ◽

2018 ◽

Author(s):

Soma Aurelio ◽

Armando Matteo ◽

Margesin Benno

Keyword(s):

Fem Simulation ◽

Plastic Behaviour ◽

Non Linear

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A multiband RF MEMS switch with low insertion loss and CMOS-compatible pull-in voltage

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394202 ◽

2018 ◽

Cited By ~ 2

Author(s):

Alabi Bojesomo ◽

Numan Saeed ◽

Ibrahim M. Elfadel

Keyword(s):

Insertion Loss ◽

Rf Mems ◽

Rf Mems Switch ◽

Mems Switch ◽

Cmos Compatible ◽

Low Insertion Loss

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Electrostatic vibration energy harvester using multimodal-shaped springs for pacemaker application

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394216 ◽

2018 ◽

Cited By ~ 2

Author(s):

Bogdan Vysotskyi ◽

Fabien Parrain ◽

Xavier Le Roux ◽

Elie Lefeuvre ◽

Philippe Gaucher ◽

...

Keyword(s):

Energy Harvester ◽

Vibration Energy ◽

Vibration Energy Harvester

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A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394207 ◽

2018 ◽

Author(s):

C-F Chuang ◽

K-S Chen

Keyword(s):

Picosecond Laser ◽

Laser Drilling ◽

New Technique ◽

A New Technique

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Post-fabrication soft trimming of resistive sensors

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394221 ◽

2018 ◽

Author(s):

Ibrahim Shankhour ◽

Jad Mohdad ◽

Frederick Mailly ◽

Pascal Nouet

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Simulation of the magnetic nanoparticle filling procedure of microchambers

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394192 ◽

2018 ◽

Author(s):

Peter Palovics ◽

Marta Rencz

Keyword(s):

Magnetic Nanoparticle

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On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394181 ◽

2018 ◽

Cited By ~ 1

Author(s):

Alabi Bojesomo ◽

Wajih Syed ◽

Ibrahim M. Elfadel

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An all screen-printed free-standing piezoelectric diaphragm for application on textile

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394208 ◽

2018 ◽

Author(s):

Nursabirah Jamel ◽

Russel Torah ◽

Kai Yang ◽

John Tudor ◽

Steve P Beeby

Keyword(s):

Free Standing ◽

Screen Printed

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2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A novel metering component for volume management in flow-based microfluidic biochips

Synergistic photoluminescent interaction of Si and CdTe quantum dots

Non-linear FEM simulation of the elasto-plastic behaviour in MEMS specimens

A multiband RF MEMS switch with low insertion loss and CMOS-compatible pull-in voltage

Electrostatic vibration energy harvester using multimodal-shaped springs for pacemaker application

A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

Post-fabrication soft trimming of resistive sensors

Simulation of the magnetic nanoparticle filling procedure of microchambers

On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS

An all screen-printed free-standing piezoelectric diaphragm for application on textile

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
Latest Publications