2008 IEEE 9th VLSI Packaging Workshop of Japan
Latest Publications

TOTAL DOCUMENTS

62

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9781424434985

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Material property calculation of interposer card for modeling of Package-on-Package

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762199 ◽

2008 ◽

Author(s):

Masanori Kuzuno ◽

Hirokazu Noma ◽

Toshihiko Nishio

Keyword(s):

Material Property

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A study on high-speed transmission characteristics of interconnections from PCB to chip

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762213 ◽

2008 ◽

Author(s):

Keitro Yamagishi ◽

Takuma Ishibashi ◽

Hideyuki Ohashi ◽

Seiichi Saito

Keyword(s):

Transmission Characteristics

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Session 6 Advanced material

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762221 ◽

2008 ◽

Author(s):

Kanji Otsuka ◽

Ricky Lee

Keyword(s):

Advanced Material

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Enhanced power supply structure with new mesh wiring and electroless plated shunt line and assembly-stress-relaxation structure

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762209 ◽

2008 ◽

Author(s):

Taichi Nishio ◽

Kazuhiro Ishikawa ◽

Fumito Itoh ◽

Yutaka Itoh ◽

Chikako Karatani ◽

...

Keyword(s):

Stress Relaxation ◽

Power Supply ◽

Relaxation Structure

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2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762220 ◽

2008 ◽

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Chip Package Interaction analysis for Cu/Ultra low-k large die Flip Chip Ball Grid Array

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762216 ◽

2008 ◽

Author(s):

Chihiro J. Uchibori ◽

Michael Lee ◽

Xeufeng Zhang ◽

Paul S. Ho

Keyword(s):

Flip Chip ◽

Interaction Analysis ◽

Ball Grid Array ◽

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Analysis of high performance RF integrated passive circuits using the glass substrate

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762233 ◽

2008 ◽

Author(s):

Chen-Chao Wang ◽

Hsueh-An Yang ◽

Ying-Chieh Shyu ◽

Meng-Hsun Li ◽

Chi-Tsung Chiu ◽

...

Keyword(s):

Glass Substrate ◽

High Performance ◽

Passive Circuits

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Session 2 thermal design

2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762193 ◽

2008 ◽

Author(s):

Nobuo Kamehara ◽

Rolf Aschenbrenner

Keyword(s):

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2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762239 ◽

2008 ◽

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2008 IEEE 9th VLSI Packaging Workshop of Japan ◽

10.1109/vpwj.2008.4762201 ◽

2008 ◽

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