2008 IEEE 9th VLSI Packaging Workshop of Japan
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9781424434985
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Session 6 Advanced material

2008 ◽  
Author(s):  
Kanji Otsuka ◽  
Ricky Lee
Keyword(s):  
Advanced Material

Enhanced power supply structure with new mesh wiring and electroless plated shunt line and assembly-stress-relaxation structure

2008 ◽  
Author(s):  
Taichi Nishio ◽  
Kazuhiro Ishikawa ◽  
Fumito Itoh ◽  
Yutaka Itoh ◽  
Chikako Karatani ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Power Supply ◽  
Relaxation Structure

A study on high-speed transmission characteristics of interconnections from PCB to chip

2008 ◽  
Author(s):  
Keitro Yamagishi ◽  
Takuma Ishibashi ◽  
Hideyuki Ohashi ◽  
Seiichi Saito
Keyword(s):  
High Speed ◽  
Transmission Characteristics

Analysis of high performance RF integrated passive circuits using the glass substrate

2008 ◽  
Author(s):  
Chen-Chao Wang ◽  
Hsueh-An Yang ◽  
Ying-Chieh Shyu ◽  
Meng-Hsun Li ◽  
Chi-Tsung Chiu ◽  
...  
Keyword(s):  
Glass Substrate ◽  
High Performance ◽  
Passive Circuits

Session 5 Flip chip and interconnection

2008 ◽  
Author(s):  
Hirofumi Nakajima ◽  
Tomoshi Ohde
Keyword(s):  
Flip Chip
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