Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95
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112

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Published By IEEE

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Sintering behavior of silver with various glass frits

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541022 ◽

2002 ◽

Author(s):

T. Oba ◽

A. Inaba

Keyword(s):

Sintering Behavior

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The analysis on bridge between leads of quad flat package in reflow soldering on printed circuit boards

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541074 ◽

2002 ◽

Author(s):

C. Lee ◽

K. Yamamoto ◽

H. Shimokawa ◽

T. Soga

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Reflow Soldering ◽

Printed Circuit ◽

Quad Flat Package

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Monolithic MCP using photosensitive glass

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541021 ◽

2002 ◽

Author(s):

T. Sakamoto ◽

K. Takahashi ◽

S. Takeuchi

Keyword(s):

Photosensitive Glass

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Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.540991 ◽

2002 ◽

Author(s):

T. Kawamura ◽

N. Yamanaka ◽

T. Matsumura ◽

H. Ichino ◽

C. Yamaguchi ◽

...

Keyword(s):

Low Power ◽

System Design ◽

Switching System ◽

Large Capacity

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OSP coatings: the nitrogen solution

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541003 ◽

2002 ◽

Author(s):

D. Verbockhaven ◽

G. Conard

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Reflow soldering using selective infrared radiation

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541070 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Sakuyama ◽

H. Uchida ◽

I. Watanabe ◽

K. Natori ◽

T. Sato

Keyword(s):

Infrared Radiation ◽

Reflow Soldering

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Small sized synthesizer module for 1.9 GHz digital mobile communication

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.540988 ◽

2002 ◽

Cited By ~ 1

Author(s):

Y. Shizuki ◽

Y. Iseki ◽

C. Tabahashi ◽

H. Yoshida ◽

M. Mori ◽

...

Keyword(s):

Mobile Communication

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Modelling of the initial stages of the anisotropic adhesive joint assembly process

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541013 ◽

2002 ◽

Cited By ~ 3

Author(s):

S.H. Mannan ◽

D.C. Whalley ◽

Y.O. Ogunjimi ◽

D.J. Williams

Keyword(s):

Adhesive Joint ◽

Assembly Process ◽

Joint Assembly

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Studies on thin film integral passive components for mixed mode multichip module (MCM) applications

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541063 ◽

2002 ◽

Author(s):

K.W. Paik

Keyword(s):

Thin Film ◽

Mixed Mode ◽

Multichip Module ◽

Passive Components

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A new metric for microelectronic package assessment: application to micro/chip scale packages

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.541029 ◽

2002 ◽

Cited By ~ 1

Author(s):

C.E. Bauer ◽

H. Hokden

Keyword(s):

Microelectronic Package

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Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Sintering behavior of silver with various glass frits

The analysis on bridge between leads of quad flat package in reflow soldering on printed circuit boards

Monolithic MCP using photosensitive glass

Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

OSP coatings: the nitrogen solution

Reflow soldering using selective infrared radiation

Small sized synthesizer module for 1.9 GHz digital mobile communication

Modelling of the initial stages of the anisotropic adhesive joint assembly process

Studies on thin film integral passive components for mixed mode multichip module (MCM) applications

A new metric for microelectronic package assessment: application to micro/chip scale packages

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95
Latest Publications