Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

2006 ◽

Cited By ~ 1

Author(s):

J.A. Visser ◽

A. Zaghlol ◽

F.D. Conradie

Keyword(s):

Experimental Results ◽

Heat Sinks

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Durability of Pb-Free solder connection between copper interconect wire and crystalline silicon solar cells

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645486 ◽

2006 ◽

Cited By ~ 3

Author(s):

G. Cuddalorepanal ◽

A. Dasgupta ◽

S. Sealing ◽

J. Moyer ◽

T. Tolliver ◽

...

Keyword(s):

Solar Cells ◽

Crystalline Silicon ◽

Silicon Solar Cells ◽

Crystalline Silicon Solar Cells ◽

Free Solder

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Multiscale Stress Analysis Using EDIP Silicon

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645439 ◽

2006 ◽

Author(s):

Chunjian Ni ◽

J. Murthy

Keyword(s):

Stress Analysis

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Coupled Thermal / Electrical Analysis of High Powered Electrical Systems

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645328 ◽

2006 ◽

Author(s):

B. Zandi ◽

J. Lewis ◽

H. Lewis ◽

M. Keyhani

Keyword(s):

Electrical Systems ◽

Electrical Analysis

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Various aspects of forced convection cooling of a hard disk drive in a consumer electronics application

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645425 ◽

2006 ◽

Cited By ~ 3

Author(s):

R. van Es ◽

A. Geerlings ◽

P. Hidding

Keyword(s):

Hard Disk Drive ◽

Forced Convection ◽

Hard Disk ◽

Disk Drive ◽

Consumer Electronics ◽

Convection Cooling

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A System Design of Liquid Cooling Computer Based on the Micro Cooling Technology

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645337 ◽

2006 ◽

Cited By ~ 4

Author(s):

Jae-Young Chang ◽

Hee Sung Park ◽

Jong In Jo ◽

S. Julia

Keyword(s):

System Design ◽

Liquid Cooling ◽

Computer Based ◽

Cooling Technology

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Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645492 ◽

2006 ◽

Cited By ~ 6

Author(s):

S. Kanuparthi ◽

X. Zhang ◽

G. Subbarayan ◽

B. Sammakia ◽

A. Gowda ◽

...

Keyword(s):

Random Distribution ◽

Thermal Interface Materials ◽

Interfacial Resistance ◽

Thermal Interface ◽

Full Field ◽

Interface Materials

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Effect of Under Floor Blockages on Data Center Performance

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645374 ◽

2006 ◽

Cited By ~ 11

Author(s):

S. Bhopte ◽

B. Sammakia ◽

R. Schmidt ◽

M.K. Iyengar ◽

D. Agonafer

Keyword(s):

Data Center

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Failure rate prediction and prevention of die cracking in over molded plastic packages

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645429 ◽

2006 ◽

Cited By ~ 4

Author(s):

B. Vijayakumar ◽

Yifan Guo

Keyword(s):

Failure Rate ◽

Rate Prediction ◽

Plastic Packages ◽

Prediction And Prevention

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Effect of Quantum Confinement on the Thermoelectric Properties of Semiconductor 2D Thin Films and 1D Wires

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645495 ◽

2006 ◽

Cited By ~ 1

Author(s):

A. Bulusu ◽

D.G. Walker

Keyword(s):

Thin Films ◽

Thermoelectric Properties ◽

Quantum Confinement

Download Full-text

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A Comparison between Predicted and Experimental Results for Swaged Fin Heat Sinks

Durability of Pb-Free solder connection between copper interconect wire and crystalline silicon solar cells

Multiscale Stress Analysis Using EDIP Silicon

Coupled Thermal / Electrical Analysis of High Powered Electrical Systems

Various aspects of forced convection cooling of a hard disk drive in a consumer electronics application

A System Design of Liquid Cooling Computer Based on the Micro Cooling Technology

Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance

Effect of Under Floor Blockages on Data Center Performance

Failure rate prediction and prevention of die cracking in over molded plastic packages

Effect of Quantum Confinement on the Thermoelectric Properties of Semiconductor 2D Thin Films and 1D Wires

Export Citation Format

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A Comparison between Predicted and Experimental Results for Swaged Fin Heat Sinks

Durability of Pb-Free solder connection between copper interconect wire and crystalline silicon solar cells

Multiscale Stress Analysis Using EDIP Silicon

Coupled Thermal / Electrical Analysis of High Powered Electrical Systems

Various aspects of forced convection cooling of a hard disk drive in a consumer electronics application

A System Design of Liquid Cooling Computer Based on the Micro Cooling Technology

Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance

Effect of Under Floor Blockages on Data Center Performance

Failure rate prediction and prevention of die cracking in over molded plastic packages

Effect of Quantum Confinement on the Thermoelectric Properties of Semiconductor 2D Thin Films and 1D Wires

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
Latest Publications