2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
Latest Publications

TOTAL DOCUMENTS

111

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780383125

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Plasma-damage optimization of the liner-removal process for 300 mm 0.13 μm copper dual-damascene BEOL manufacturing

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309568 ◽

2004 ◽

Author(s):

Shu-Huei Sun ◽

Shih-Ming Chen ◽

Joseph Weng-Liang Fang ◽

Ching-Yu Huang ◽

Tsai-Chun Li ◽

...

Keyword(s):

Plasma Damage ◽

Removal Process ◽

Dual Damascene

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Advanced STI patterning for 70 nm DRAM technology and beyond

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309541 ◽

2004 ◽

Author(s):

M. Stavrev ◽

A. Scire ◽

M. Vogt ◽

P. Klingbeil ◽

Chun-Cheng Liao ◽

...

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The impact of staffing on cycle time evaluated by simulation

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309600 ◽

2004 ◽

Author(s):

N. Kroehn

Keyword(s):

Cycle Time ◽

The Impact

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Yield enhancement through defect reduction for post wet silicon nitride etch applications

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309525 ◽

2004 ◽

Cited By ~ 4

Author(s):

B.M. Dries

Keyword(s):

Silicon Nitride ◽

Yield Enhancement ◽

Defect Reduction

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A method for controlling residual film stress in LPCVD polysilicon films for surface micromachined MEMS

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309604 ◽

2004 ◽

Cited By ~ 2

Author(s):

J. Woloszyn

Keyword(s):

Film Stress ◽

Residual Film ◽

Polysilicon Films

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Analysis of wafer process duration for ab initio calculation of capacity, throughput and bottleneck equipments in a wafer fab

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309591 ◽

2004 ◽

Author(s):

H. Etzel ◽

P. Staudt ◽

H. Oertel ◽

R. Dudde

Keyword(s):

Ab Initio ◽

Ab Initio Calculation ◽

Process Duration ◽

Wafer Fab

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The use of unified APC/FD in the control of a metal etch area

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309573 ◽

2004 ◽

Cited By ~ 1

Author(s):

J. Hyde ◽

J. Doxsey ◽

J. Card

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Application of advanced macro defect inspection technology for MEMS processes

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309598 ◽

2004 ◽

Author(s):

D.E. Grosjean ◽

R.H. Elwell ◽

J.L. Keller ◽

M. Clay

Keyword(s):

Defect Inspection

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Novel cantilever for biosensing applications

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309606 ◽

2004 ◽

Cited By ~ 2

Author(s):

O.G. Karhade ◽

S.S. Chiluveru ◽

P.R. Apte

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A simulation study of dispatching rules and rework strategies in semiconductor manufacturing

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309590 ◽

2004 ◽

Cited By ~ 8

Author(s):

M.E. Kuhl ◽

G.R. Laubisch

Keyword(s):

Simulation Study ◽

Semiconductor Manufacturing ◽

Dispatching Rules

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2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Plasma-damage optimization of the liner-removal process for 300 mm 0.13 μm copper dual-damascene BEOL manufacturing

Advanced STI patterning for 70 nm DRAM technology and beyond

The impact of staffing on cycle time evaluated by simulation

Yield enhancement through defect reduction for post wet silicon nitride etch applications

A method for controlling residual film stress in LPCVD polysilicon films for surface micromachined MEMS

Analysis of wafer process duration for ab initio calculation of capacity, throughput and bottleneck equipments in a wafer fab

The use of unified APC/FD in the control of a metal etch area

Application of advanced macro defect inspection technology for MEMS processes

Novel cantilever for biosensing applications

A simulation study of dispatching rules and rework strategies in semiconductor manufacturing

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
Latest Publications