2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
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Analysis of wafer process duration for ab initio calculation of capacity, throughput and bottleneck equipments in a wafer fab

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309591 ◽

2004 ◽

Author(s):

H. Etzel ◽

P. Staudt ◽

H. Oertel ◽

R. Dudde

Keyword(s):

Ab Initio ◽

Ab Initio Calculation ◽

Process Duration ◽

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The use of unified APC/FD in the control of a metal etch area

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309573 ◽

2004 ◽

Author(s):

J. Hyde ◽

J. Doxsey ◽

J. Card

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The impact of staffing on cycle time evaluated by simulation

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309600 ◽

2004 ◽

Author(s):

N. Kroehn

Keyword(s):

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Yield enhancement through defect reduction for post wet silicon nitride etch applications

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309525 ◽

2004 ◽

Author(s):

B.M. Dries

Keyword(s):

Silicon Nitride ◽

Yield Enhancement ◽

Defect Reduction

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A method for controlling residual film stress in LPCVD polysilicon films for surface micromachined MEMS

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309604 ◽

2004 ◽

Author(s):

J. Woloszyn

Keyword(s):

Film Stress ◽

Residual Film ◽

Polysilicon Films

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Plasma-damage optimization of the liner-removal process for 300 mm 0.13 μm copper dual-damascene BEOL manufacturing

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309568 ◽

2004 ◽

Author(s):

Shu-Huei Sun ◽

Shih-Ming Chen ◽

Joseph Weng-Liang Fang ◽

Ching-Yu Huang ◽

Tsai-Chun Li ◽

...

Keyword(s):

Plasma Damage ◽

Removal Process ◽

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Advanced STI patterning for 70 nm DRAM technology and beyond

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309541 ◽

2004 ◽

Author(s):

M. Stavrev ◽

A. Scire ◽

M. Vogt ◽

P. Klingbeil ◽

Chun-Cheng Liao ◽

...

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A simulation study of dispatching rules and rework strategies in semiconductor manufacturing

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309590 ◽

2004 ◽

Author(s):

M.E. Kuhl ◽

G.R. Laubisch

Keyword(s):

Simulation Study ◽

Semiconductor Manufacturing ◽

Dispatching Rules

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Leveraging mainstream design and analysis tools for MEMS

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309563 ◽

2004 ◽

Author(s):

I. Mirman ◽

D. Flanders

Keyword(s):

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Reduction of CMP μ-scratch induced metal shorts by introduction of a post CMP tungsten plasma clean process in a high volume DRAM manufacturing environment

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ◽

10.1109/asmc.2004.1309523 ◽

2004 ◽

Author(s):

H. Ollendorf ◽

S. Cabral ◽

R. Fuller

Keyword(s):

High Volume ◽

Manufacturing Environment

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