2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Latest Publications

TOTAL DOCUMENTS

40

(FIVE YEARS 40)

H-INDEX

0

(FIVE YEARS 0)

Published By IEEE

9781728194127

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Multiphysics challenges with Heterogeneous Integrated Voltage Regulator based Power Delivery Architectures

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312894 ◽

2020 ◽

Author(s):

Venkatesh Avula ◽

Bidyut Bhattacharyya ◽

Vanessa Smet ◽

Yogendra Joshi ◽

Madhavan Swaminathan

Keyword(s):

Power Delivery ◽

Voltage Regulator

Download Full-text

Divide by Two Injection-Locked Frequency Divider Using 3-D Inductive Mutual-Coupling

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312893 ◽

2020 ◽

Author(s):

Wen-Cheng Lai ◽

Sheng-Lyang Jang

Keyword(s):

Mutual Coupling ◽

Frequency Divider

Download Full-text

On Die Clock Tree PSIJ Simplified

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312910 ◽

2020 ◽

Author(s):

Vinod Arjun Huddar

Keyword(s):

Download Full-text

Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312909 ◽

2020 ◽

Author(s):

Gapyeol Park ◽

Hyunwook Park ◽

Daehwan Lho ◽

Junyong Park ◽

Kyungjune Son ◽

...

Keyword(s):

Signal Integrity

Download Full-text

Power Delivery Network Design and Optimization for Ethernet I/O

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312901 ◽

2020 ◽

Author(s):

Siri Holla ◽

Mukesh Moorthy ◽

Manjunath Jayasimha

Keyword(s):

Network Design ◽

Power Delivery ◽

Design And Optimization ◽

Power Delivery Network ◽

Delivery Network

Download Full-text

Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312890 ◽

2020 ◽

Author(s):

Kota Shiba ◽

Tatsuo Omori ◽

Mitsuji Okada ◽

Mototsugu Hamada ◽

Tadahiro Kuroda

Keyword(s):

High Density ◽

Inductive Coupling ◽

Download Full-text

A Large-Signal Method for Modeling Vccin feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312913 ◽

2020 ◽

Author(s):

Srinivasan Govindan ◽

Krishna Bharath ◽

Srikrishnan Venkataraman ◽

Dipanjan Gope

Keyword(s):

Voltage Regulators ◽

Large Signal ◽

Fully Integrated ◽

Download Full-text

Sub-picosecond Skew Matching

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312916 ◽

2020 ◽

Author(s):

Minh Quach ◽

Nur Devnani ◽

Mark Hinton ◽

Ravi Kaw

Download Full-text

Investigation of Sideway Coupling Effects of Virtual Ground in Three Types of Coupled Line with Mixed-mode Stimuli

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312896 ◽

2020 ◽

Author(s):

Lih-Tyng Hwang ◽

Chun Cheng Wang ◽

Ming Yuan Huang ◽

Hung-Chih Lin ◽

Chien-Chang Huang

Keyword(s):

Coupling Effects ◽

Download Full-text

Power Distribution Network Optimization for On-Die Regulator with Laplace Transform Technique

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps50281.2020.9312912 ◽

2020 ◽

Author(s):

Michael Chang

Keyword(s):

Laplace Transform ◽

Network Optimization ◽

Power Distribution ◽

Distribution Network ◽

Power Distribution Network ◽

Laplace Transform Technique

Download Full-text