2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

115

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781509047697

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Component drop-off caused by gold embrittlement

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800012 ◽

2016 ◽

Author(s):

Chun-Chi Chiu ◽

Hsun-Fa Li

Keyword(s):

Gold Embrittlement

Observation and analysis of metal oxide reduction by formic acid for soldering

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7799990 ◽

2016 ◽

Author(s):

Naoto Ozawa ◽

Tatsuo Okubo ◽

Jun Matsuda ◽

Tatsuo Sakai

Keyword(s):

Metal Oxide ◽

Formic Acid ◽

Oxide Reduction ◽

Metal Oxide Reduction

The new vertical continuous transport equipment, U-VCPS

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800006 ◽

2016 ◽

Author(s):

Jl. Huang ◽

Ken Wang

Keyword(s):

Transport Equipment

Advanced materials with low dielectric properties and highly thermal conductivity

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800072 ◽

2016 ◽

Cited By ~ 1

Author(s):

Wen-Pin Ting ◽

Feng-Po Tseng ◽

Kuo-Chan Chiou

Keyword(s):

Thermal Conductivity ◽

Dielectric Properties ◽

Advanced Materials ◽

Low Dielectric

Inkjet printing of nano-silver conductive lines on polyimide substrates

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800018 ◽

2016 ◽

Cited By ~ 1

Author(s):

Chia-Yen Chan ◽

Kuan-Cheng Shih ◽

Ting-Ming Huang

Keyword(s):

Inkjet Printing ◽

Nano Silver

Novel design for high thermal performance and SMT process yield QFP

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800008 ◽

2016 ◽

Cited By ~ 1

Author(s):

Ian Hu ◽

P. C. Liu

Keyword(s):

Thermal Performance ◽

Process Yield ◽

Novel Design

A dual band divide by four frequency divider for biomedical sensor and wearable applications

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800014 ◽

2016 ◽

Cited By ~ 1

Author(s):

Wen-Cheng Lai ◽

Sheng-Lyang Jang ◽

Cheng-Lin Li

Keyword(s):

Frequency Divider ◽

Dual Band ◽

Biomedical Sensor

Grain growth of (111) nanotwined Cu on (100)-oriented Cu films

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800027 ◽

2016 ◽

Cited By ~ 1

Author(s):

Hsin-Yong Liu ◽

Chih Chen

Keyword(s):

Grain Growth ◽

Cu Films

Novel approach for search engine

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7799977 ◽

2016 ◽

Author(s):

Yoichi Sato ◽

Kanji Otsuka ◽

Kaoru Kobayashi ◽

Toshiyuki Kouchi ◽

Minoru Uwai ◽

...

Keyword(s):

Search Engine ◽

Novel Approach

Reliability-driven high-level synthesis with clock frequency considered

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800034 ◽

2016 ◽

Author(s):

Wen-Zen Cheng ◽

Chun-Hua Cheng ◽

Shih-Hsu Huang

Keyword(s):

High Level Synthesis ◽

Clock Frequency ◽

High Level

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Component drop-off caused by gold embrittlement

Observation and analysis of metal oxide reduction by formic acid for soldering

The new vertical continuous transport equipment, U-VCPS

Advanced materials with low dielectric properties and highly thermal conductivity

Inkjet printing of nano-silver conductive lines on polyimide substrates

Novel design for high thermal performance and SMT process yield QFP

A dual band divide by four frequency divider for biomedical sensor and wearable applications

Grain growth of (111) nanotwined Cu on (100)-oriented Cu films

Novel approach for search engine

Reliability-driven high-level synthesis with clock frequency considered

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications